Ithagethi inemisebenzi eminingi kanye nezinhlelo zokusebenza ezibanzi emikhakheni eminingi. Imishini emisha yokuphalaza icishe isebenzisa omazibuthe abanamandla ukuzungeza ama-electron ukuze kusheshiswe i-ionization ye-argon endaweni okuhlosiwe, okwandisa amathuba okushayisana phakathi kwethagethi nama-argon ions,
Khulisa izinga lokufafaza. Ngokuvamile, i-DC sputtering isetshenziselwa ukuhlanganisa insimbi, kuyilapho i-RF sputtering yokuxhumana isetshenziselwa izinto ezingezona ze-ceramic kazibuthe. Umgomo oyisisekelo uwukusebenzisa ukukhishwa okukhazimulayo ukuze ushaye ama-ion e-argon (AR) ebusweni bethagethi ku-vacuum, futhi ama-cations ku-plasma azosheshisa ukuphuthuma endaweni engalungile ye-electrode njengento efafaziwe. Lo mthelela uzokwenza impahla yethagethi indize iphume futhi ifake ku-substrate ukuze yenze ifilimu.
Ngokuvamile, kunezici ezimbalwa zokumboza ifilimu kusetshenziswa inqubo ye-sputtering:
(1) Insimbi, i-alloy noma isivikelo singenziwa sibe idatha yefilimu emincane.
(2) Ngaphansi kwezimo ezifanele zokusetha, ifilimu enokwakheka okufanayo ingenziwa ngezinto ezihlosiwe eziningi nezingahlelekile.
(3) Ingxube noma inhlanganisela yezinto ezihlosiwe kanye nama-molecule egesi angenziwa ngokungeza umoya-mpilo noma amanye amagesi asebenzayo emkhathini wokuphuma.
(4) Isikhathi samanje sokufakwayo okuhlosiwe kanye nesikhathi sokufafaza singalawulwa, futhi kulula ukuthola ukujiya kwefilimu okunembe kakhulu.
(5) Kuyazuzisa ukukhiqizwa kwamanye amafilimu.
(6) Izinhlayiya ezihlakazekile azithinteki amandla adonsela phansi, futhi okuhlosiwe kanye ne-substrate kungahlelwa ngokukhululeka.
Isikhathi sokuthumela: May-24-2022