Ukuvikela amasistimu e-elekthronikhi ekuphazamisekeni kwe-electromagnetic (EMI) sekuyisihloko esishisayo. Intuthuko yezobuchwepheshe ezindinganisweni ze-5G, ukushaja okungenantambo kwama-elekthronikhi eselula, ukuhlanganiswa kwe-antenna ku-chassis, kanye nokwethulwa kwe-System in Package (SiP) kuqhuba isidingo sokuvikela okungcono kwe-EMI kanye nokuhlukaniswa kwamaphakheji wezingxenye kanye nezinhlelo zokusebenza zemodular ezinkulu. Ngokuvikela okusemthethweni, izinto ezivikelayo ze-EMI zezindawo zangaphandle zephakeji zifakwa ikakhulukazi kusetshenziswa izinqubo ze-physical vapor deposition (PVD) kusetshenziswa ubuchwepheshe bokupakisha ngaphambilini ekufakweni kokupakisha kwangaphakathi. Kodwa-ke, ukuqina kanye nezinkinga zezindleko zobuchwepheshe besifutho, kanye nenqubekela phambili ezintweni ezisebenzisekayo, kuholela ekucatshangweni kwezinye izindlela zokufutha zokuvikela i-EMI.
Ababhali bazodingida ukuthuthukiswa kwezinqubo zokumboza izifutho zokusebenzisa izinto zokuvikela ze-EMI endaweni yangaphandle yezingxenye ngazinye emigqeni kanye namaphakheji amakhulu e-SiP. Ngokusetshenziswa kwezinto nezinto zokusebenza ezisanda kuthuthukiswa nezithuthukisiwe embonini, kukhonjisiwe inqubo ehlinzeka ngokufana okufanayo kumaphakheji angaphansi kwama-microns ayi-10 awugqinsi kanye nokumbozwa okufanayo emakhoneni ephakheji nasezindongeni ezisemaceleni. Isilinganiso sodonga oluhlangothini 1:1. Olunye ucwaningo selukhombisile ukuthi izindleko zokukhiqiza zokusebenzisa isivikelo se-EMI kumaphakeji ezingxenye zingancishiswa ngokukhuphula izinga lokufafaza nangokukhetha ngokukhetha okokunamathela ezindaweni ezithile zephakeji. Ukwengeza, izindleko zemali ephansi zemishini kanye nesikhathi esifushane sokusetha imishini yokufafaza uma kuqhathaniswa nemishini yokufafaza kuthuthukisa ikhono lokukhulisa umthamo wokukhiqiza.
Lapho bepakisha ama-electronics eselula, abanye abakhiqizi bamamojula we-SiP babhekana nenkinga yokuhlukanisa izingxenye ngaphakathi kwe-SiP kusuka komunye nomunye nangaphandle ukuze bavikeleke ekuphazamisekeni kwe-electromagnetic. Ama-grooves asikwa azungeze izakhi zangaphakathi futhi unamathisele conductive kusetshenziswa emiseleni ukuze kwakhiwe ikheji elincane le-Faraday ngaphakathi kwekesi. Njengoba umklamo womsele uyancipha, kuyadingeka ukulawula ivolumu nokunemba kokubekwa kwezinto ezigcwalisa umsele. Imikhiqizo yakamuva yokuqhuma ethuthukisiwe ilawula ivolumu kanye nobubanzi bokugeleza komoya obuncane buqinisekisa ukugcwaliswa komsele okunembile. Esinyathelweni sokugcina, iziqongo zale misele egcwele ukunamathisela zinamathiselwe ndawonye ngokufaka i-EMI yangaphandle yokuvikela inamathela. I-Spray Coating ixazulula izinkinga ezihlobene nokusetshenziswa kwemishini yokufafaza futhi isizakala ngezinto ezithuthukisiwe ze-EMI kanye nemishini yokubeka, ivumela amaphakheji e-SiP ukuthi enziwe kusetshenziswa izindlela zokupakisha zangaphakathi eziphumelelayo.
Eminyakeni yamuva nje, ukuvikela i-EMI sekuyinkinga enkulu. Ngokwamukelwa kancane kancane okujwayelekile kobuchwepheshe obungenawaya be-5G kanye namathuba esikhathi esizayo i-5G ezowaletha ku-inthanethi Yezinto (IoT) kanye nokuxhumana okubalulekile komgomo, isidingo sokuvikela ngempumelelo izingxenye ze-elekthronikhi nemihlangano ekuphazamisekeni kozibuthe kagesi sikhule. kubalulekile. Ngezinga elizayo le-5G elingenantambo, amafrikhwensi esignali ku-600 MHz kuya ku-6 GHz kanye namabhendi ama-millimeter wave azovame kakhulu futhi abe namandla njengoba kwamukelwa ubuchwepheshe. Ezinye izimo ezihlongozwayo zokusebenzisa nokusebenzisa kuhlanganisa amafasitelana ezakhiwo zamahhovisi noma izinto zokuhamba zomphakathi ukusiza ukugcina ukuxhumana kuqhelelene.
Ngenxa yokuthi amafrikhwensi e-5G anobunzima bokungena ezindongeni nezinye izinto eziqinile, okunye ukuqaliswa okuhlongozwayo kufaka phakathi abaphindayo ezindlini nezakhiwo zamahhovisi ukuze kuhlinzekwe ukumbozwa okwanele. Zonke lezi zenzo zizoholela ekwenyukeni kokusabalala kwamasiginali kumabhendi efrikhwensi ye-5G kanye nengozi ephezulu yokuchayeka ekuphazamiseni kazibuthe kagesi kulawa mabhendi amafrikhwensi kanye nama-harmonics awo.
Ngenhlanhla, i-EMI ingavikelwa ngokufaka i-metal coating encane, eqhubayo ezingxenyeni zangaphandle kanye namadivayisi we-System-in-Package (SiP) (Umfanekiso 1). Esikhathini esedlule, ukuvikela kwe-EMI bekusetshenziswa ngokubeka amathini ensimbi anesitembu emaqenjini ezingxenye, noma ngokufaka itheyiphu yokuvikela ezingxenyeni ngazinye. Kodwa-ke, njengoba amaphakheji namadivayisi wokugcina aqhubeka enziwa ama-miniaturized, le ndlela yokuvikela iba yinto engamukeleki ngenxa yemikhawulo kasayizi kanye nokuguquguquka kokusingatha imiqondo yephakheji ehlukahlukene, engeyona eye-orthogonal esetshenziswa kakhulu kuma-elekthronikhi eselula futhi agqokekayo.
Ngokunjalo, eminye imiklamo yephakeji ehamba phambili ibhekela ekumbozeni ngokukhetha kuphela izindawo ezithile zephakeji zokuvikela i-EMI, kunokumboza ingaphandle lonke lephakheji ngephakheji eligcwele. Ngokungeziwe ekuvikelweni kwe-EMI kwangaphandle, amadivayisi amasha e-SiP adinga isivikelo esengeziwe esakhelwe ngaphakathi esakhelwe ngqo ephaketheni ukuze sihlukanise kahle izingxenye ezihlukahlukene komunye nomunye kuphakheji efanayo.
Indlela eyinhloko yokudala isivikelo se-EMI kumaphakeji ezingxenye ezibunjiwe noma amadivaysi e-SiP abunjiwe ukufafaza izendlalelo eziningi zensimbi phezulu. Ngokufafaza, izimbotshana ezacile kakhulu zeyunifomu yensimbi emsulwa noma ingxubevange yensimbi ingafakwa endaweni yephakheji enogqinsi luka-1 ukuya ku-7 µm. Ngenxa yokuthi inqubo ye-sputtering iyakwazi ukufaka izinsimbi ezingeni le-angstrom, izici zikagesi zezingubo zayo kuze kube manje sezisebenze kahle ezisetshenziswa ezijwayelekile zokuvikela.
Kodwa-ke, njengoba isidingo sokuvikela sikhula, i-sputtering inobubi obuningi obuyimvelo obuyivimbela ukuthi isetshenziswe njengendlela eyingozi yabakhiqizi nabathuthukisi. Izindleko zokuqala zempahla yokufutha ziphezulu kakhulu, ebangeni lezigidi zamaRandi. Ngenxa yenqubo enamakamelo amaningi, ulayini wemishini yokufutha udinga indawo enkulu futhi ukhulisa ngokwengeziwe isidingo sezindlu ezithengiswayo ezengeziwe ngesistimu yokudlulisa edidiyelwe ngokugcwele. Izimo ezijwayelekile zegumbi le-sputter zingafinyelela ububanzi obungu-400°C njengoba ukuvuthwa kwe-plasma kuphaphaza into esuka kuthagethi ye-sputter kuya ku-substrate; ngakho-ke, i-"cold plate" yokukhweza iyadingeka ukupholisa i-substrate ukunciphisa amazinga okushisa atholakalayo. Phakathi nenqubo yokubeka, insimbi ifakwa ku-substrate enikeziwe, kodwa, njengomthetho, ukujiya kwezindonga ezima mpo zephakeji ye-3D kuvame ukufika ku-60% uma kuqhathaniswa nobukhulu bongqimba olungaphezulu.
Okokugcina, ngenxa yokuthi i-sputtering iyinqubo yokubeka umugqa wokubona, izinhlayiya zensimbi azikwazi ukuzikhethela noma kufanele zifakwe ngaphansi kwezakhiwo ezilengayo kanye nama-topology, okungaholela ekulahlekelweni okukhulu kwezinto ezibonakalayo ngaphezu kokuqoqwa kwayo ngaphakathi kwezindonga zekamelo; ngakho, kudinga ukunakekelwa okuningi. Uma izindawo ezithile ze-substrate enikeziwe zizoshiywa obala noma kungadingeki ukuvikela kwe-EMI, ingxenye engaphansi kufanele futhi imbozwe ngaphambili.
Ukuvikela amasistimu e-elekthronikhi ekuphazamisekeni kwe-electromagnetic (EMI) sekuyisihloko esishisayo. Intuthuko yezobuchwepheshe ezindinganisweni ze-5G, ukushaja okungenantambo kwama-elekthronikhi eselula, ukuhlanganiswa kwe-antenna ku-chassis, kanye nokwethulwa kwe-System in Package (SiP) kuqhuba isidingo sokuvikela okungcono kwe-EMI kanye nokuhlukaniswa kwamaphakheji wezingxenye kanye nezinhlelo zokusebenza zemodular ezinkulu. Ngokuvikela okusemthethweni, izinto ezivikelayo ze-EMI zezindawo zangaphandle zephakeji zifakwa ikakhulukazi kusetshenziswa izinqubo ze-physical vapor deposition (PVD) kusetshenziswa ubuchwepheshe bokupakisha ngaphambilini ekufakweni kokupakisha kwangaphakathi. Kodwa-ke, ukuqina kanye nezinkinga zezindleko zobuchwepheshe besifutho, kanye nenqubekela phambili ezintweni ezisebenzisekayo, kuholela ekucatshangweni kwezinye izindlela zokufutha zokuvikela i-EMI.
Ababhali bazodingida ukuthuthukiswa kwezinqubo zokumboza izifutho zokusebenzisa izinto zokuvikela ze-EMI endaweni yangaphandle yezingxenye ngazinye emigqeni kanye namaphakheji amakhulu e-SiP. Ngokusetshenziswa kwezinto nezinto zokusebenza ezisanda kuthuthukiswa nezithuthukisiwe embonini, kukhonjisiwe inqubo ehlinzeka ngokufana okufanayo kumaphakheji angaphansi kwama-microns ayi-10 awugqinsi kanye nokumbozwa okufanayo emakhoneni ephakheji nasezindongeni ezisemaceleni. Isilinganiso sodonga oluhlangothini 1:1. Olunye ucwaningo selukhombisile ukuthi izindleko zokukhiqiza zokusebenzisa isivikelo se-EMI kumaphakeji ezingxenye zingancishiswa ngokukhuphula izinga lokufafaza nangokukhetha ngokukhetha okokunamathela ezindaweni ezithile zephakeji. Ukwengeza, izindleko zemali ephansi zemishini kanye nesikhathi esifushane sokusetha imishini yokufafaza uma kuqhathaniswa nemishini yokufafaza kuthuthukisa ikhono lokukhulisa umthamo wokukhiqiza.
Lapho bepakisha ama-electronics eselula, abanye abakhiqizi bamamojula we-SiP babhekana nenkinga yokuhlukanisa izingxenye ngaphakathi kwe-SiP kusuka komunye nomunye nangaphandle ukuze bavikeleke ekuphazamisekeni kwe-electromagnetic. Ama-grooves asikwa azungeze izakhi zangaphakathi futhi unamathisele conductive kusetshenziswa emiseleni ukuze kwakhiwe ikheji elincane le-Faraday ngaphakathi kwekesi. Njengoba umklamo womsele uyancipha, kuyadingeka ukulawula ivolumu nokunemba kokubekwa kwezinto ezigcwalisa umsele. Imikhiqizo yakamuva yokuqhuma ethuthukisiwe ilawula umthamo kanye nobubanzi obuncane bokugeleza komoya buqinisekisa ukugcwaliswa komsele okunembile. Esinyathelweni sokugcina, iziqongo zale misele egcwele ukunamathisela zinamathiselwe ndawonye ngokufaka i-EMI yangaphandle yokuvikela inamathela. I-Spray Coating ixazulula izinkinga ezihlobene nokusetshenziswa kwemishini yokufafaza futhi isizakala ngezinto ezithuthukisiwe ze-EMI kanye nemishini yokubeka, ivumela amaphakheji e-SiP ukuthi enziwe kusetshenziswa izindlela zokupakisha zangaphakathi eziphumelelayo.
Eminyakeni yamuva nje, ukuvikela i-EMI sekuyinkinga enkulu. Ngokwamukelwa kancane kancane okujwayelekile kobuchwepheshe obungenawaya be-5G kanye namathuba esikhathi esizayo i-5G ezowaletha ku-inthanethi Yezinto (IoT) kanye nokuxhumana okubalulekile komgomo, isidingo sokuvikela ngempumelelo izingxenye ze-elekthronikhi nemihlangano ekuphazamisekeni kozibuthe kagesi sikhule. kubalulekile. Ngezinga elizayo le-5G elingenantambo, amafrikhwensi esignali ku-600 MHz kuya ku-6 GHz kanye namabhendi ama-millimeter wave azovame kakhulu futhi abe namandla njengoba kwamukelwa ubuchwepheshe. Ezinye izimo ezihlongozwayo zokusebenzisa nokusebenzisa kuhlanganisa amafasitelana ezakhiwo zamahhovisi noma izinto zokuhamba zomphakathi ukusiza ukugcina ukuxhumana kuqhelelene.
Ngenxa yokuthi amafrikhwensi e-5G anobunzima bokungena ezindongeni nezinye izinto eziqinile, okunye ukuqaliswa okuhlongozwayo kufaka phakathi abaphindayo ezindlini nezakhiwo zamahhovisi ukuze kuhlinzekwe ukumbozwa okwanele. Zonke lezi zenzo zizoholela ekwenyukeni kokusabalala kwamasiginali kumabhendi efrikhwensi ye-5G kanye nengozi ephezulu yokuchayeka ekuphazamiseni kazibuthe kagesi kulawa mabhendi amafrikhwensi kanye nama-harmonics awo.
Ngenhlanhla, i-EMI ingavikelwa ngokufaka i-metal coating encane, eqhubayo ezingxenyeni zangaphandle kanye namadivayisi we-System-in-Package (SiP) (Umfanekiso 1). Esikhathini esedlule, ukuvikela kwe-EMI bekusetshenziswa ngokubeka amathini ensimbi anesitembu eduze kwamaqoqo ezingxenye, noma ngokufaka itheyiphu yokuvikela ezingxenyeni ezithile. Kodwa-ke, njengoba amaphakheji namadivayisi wokugcina aqhubeka enziwa ama-miniaturized, le ndlela yokuvikela iba engamukeleki ngenxa yemikhawulo kasayizi kanye nokuguquguquka kokuphatha izinhlobonhlobo zemiqondo yephakheji engeyona ye-orthogonal etholakala ngokuqhubekayo kuma-elekthronikhi eselula futhi agqokekayo.
Ngokunjalo, eminye imiklamo yephakeji ehamba phambili ibhekela ekumbozeni ngokukhetha kuphela izindawo ezithile zephakeji zokuvikela i-EMI, kunokumboza ingaphandle lonke lephakheji ngephakheji eligcwele. Ngokungeziwe ekuvikelweni kwe-EMI kwangaphandle, amadivayisi amasha e-SiP adinga isivikelo esengeziwe esakhelwe ngaphakathi esakhelwe ngqo ephaketheni ukuze sihlukanise kahle izingxenye ezihlukahlukene komunye nomunye kuphakheji efanayo.
Indlela eyinhloko yokudala isivikelo se-EMI kumaphakeji ezingxenye ezibunjiwe noma amadivaysi e-SiP abunjiwe ukufafaza izendlalelo eziningi zensimbi phezulu. Ngokufafaza, izimbotshana ezacile kakhulu zeyunifomu yensimbi emsulwa noma ingxubevange yensimbi ingafakwa endaweni yephakheji enogqinsi luka-1 ukuya ku-7 µm. Ngenxa yokuthi inqubo ye-sputtering iyakwazi ukufaka izinsimbi ezingeni le-angstrom, izici zikagesi zezingubo zayo kuze kube manje sezisebenze kahle ezisetshenziswa ezijwayelekile zokuvikela.
Kodwa-ke, njengoba isidingo sokuvikela sikhula, i-sputtering inobubi obuningi obuyimvelo obuyivimbela ukuthi isetshenziswe njengendlela eyingozi yabakhiqizi nabathuthukisi. Izindleko zokuqala zempahla yokufutha ziphezulu kakhulu, ebangeni lezigidi zamaRandi. Ngenxa yenqubo enamakamelo amaningi, ulayini wemishini yokufutha udinga indawo enkulu futhi ukhulisa ngokwengeziwe isidingo sezindlu ezithengiswayo ezengeziwe ngesistimu yokudlulisa edidiyelwe ngokugcwele. Izimo ezijwayelekile zegumbi le-sputter zingafinyelela ububanzi obungu-400°C njengoba ukuvuthwa kwe-plasma kuphaphaza into esuka kuthagethi ye-sputter kuya ku-substrate; ngakho-ke, i-"cold plate" yokukhweza iyadingeka ukupholisa i-substrate ukunciphisa amazinga okushisa atholakalayo. Phakathi nenqubo yokubeka, insimbi ifakwa ku-substrate enikeziwe, kodwa, njengomthetho, ukujiya kwezindonga ezima mpo zephakeji ye-3D kuvame ukufika ku-60% uma kuqhathaniswa nobukhulu bongqimba olungaphezulu.
Okokugcina, ngenxa yokuthi i-sputtering iyinqubo yokubeka umugqa wokubona, izinhlayiya zensimbi azikwazi ukuzikhethela noma kufanele zifakwe ngaphansi kwezakhiwo ezilengayo kanye nama-topology, okungaholela ekulahlekelweni okukhulu kwezinto ezibonakalayo ngaphezu kokuqoqwa kwayo ngaphakathi kwezindonga zekamelo; ngakho, kudinga ukunakekelwa okuningi. Uma izindawo ezithile ze-substrate enikeziwe zizoshiywa obala noma kungadingeki ukuvikela kwe-EMI, ingxenye engaphansi kufanele futhi imbozwe ngaphambili.
Iphepha elimhlophe: Uma usuka ekukhiqizweni kwezinhlobonhlobo ezincane kuya kokukhulu, ukukhulisa ukuphuma kwamaqoqo amaningi emikhiqizo ehlukene kubalulekile ekwandiseni umkhiqizo wokukhiqiza. Ukusetshenziswa Kolayini Kukonke… Buka Iphepha Elimhlophe
Isikhathi sokuthumela: Apr-19-2023