1. Indlela ye-Magnetron sputtering:
I-Magnetron sputtering ingahlukaniswa ibe i-DC sputtering, i-medium frequency sputtering kanye ne-RF sputtering.
Ugesi we-A. DC sputtering ushibhile futhi ukuminyana kwefilimu efakiwe akulungile. Ngokuvamile, amabhethri afuywayo e-photothermal namafilimu amancane asetshenziswa ngamandla aphansi, kanti okuhlosiwe okuhlosiwe kuyithagethi yensimbi eqhubayo.
B. Amandla e-RF sputtering aphakeme, futhi okuhloswe ukuqhumisa kungase kube ithagethi engaconductive noma i-conductive target.
C. Ithagethi ye-sputtering yefrikhwensi emaphakathi ingaba ithagethi ye-ceramic noma ithagethi yensimbi.
2. Ukwahlukanisa kanye nokusetshenziswa kokuhlosiwe kwe-sputtering
Kunezinhlobo eziningi zokuhloswe nge-sputtering, nezindlela zokuhlukanisa okuhlosiwe nazo zihlukile. Ngokusho komumo, zihlukaniswe zibe yithagethi ende, inhloso yesikwele kanye nethagethi eyindilinga; Ngokusho kokwakheka, ingahlukaniswa ngethagethi yensimbi, i-alloy target kanye ne-ceramic compound target; Ngokwezinkambu ezihlukene zohlelo lokusebenza, ingahlukaniswa ibe okuhlosiwe okuhlobene ne-semiconductor ye-ceramic, ukurekhoda okuqondiwe kwe-ceramic emaphakathi, okuhlosiwe kwe-ceramic, njll. Okuhlosiwe kwe-sputtering kusetshenziswa kakhulu ezimbonini ze-elekthronikhi nezolwazi, njengemboni yokugcina ulwazi. Kulo mkhakha, okuhloswe ukuhlahlela kusetshenziselwa ukulungisa imikhiqizo yefilimu emincane efanele (i-hard disk, ikhanda lamagnetic, i-optical disc, njll.). Okwamanje. Ngokuthuthuka okuqhubekayo kwemboni yolwazi, isidingo sokuqopha okuhlosiwe kwe-ceramic emakethe siyakhula. Ucwaningo nokukhiqizwa kokuhlosiwe okuphakathi nendawo sekuyinto okugxilwe kuyo ukunakwa okubanzi.
Isikhathi sokuthumela: May-11-2022