Njengoba sonke sazi, inkambiso yentuthuko yobuchwepheshe bezinto eziqondiwe ihlobene eduze nenkambiso yokuthuthukiswa kobuchwepheshe bamafilimu embonini yesicelo esingezansi. Ngokuthuthukiswa kobuchwepheshe bemikhiqizo yefilimu noma izingxenye embonini yezicelo, ubuchwepheshe obuqondiwe kufanele buguquke. Isibonelo, abakhiqizi be-Ic basanda kugxila ekuthuthukisweni kwezintambo zethusi ezincibilikisiwe, okulindeleke ukuthi zithathe indawo enkulu yefilimu yokuqala ye-aluminium eminyakeni embalwa ezayo, ngakho-ke ukuthuthukiswa kwezinhloso zethusi kanye nezinhloso zabo zokuvimbela ezidingekayo kuzophuthuma.
Ngaphezu kwalokho, eminyakeni yamuva nje, i-flat panel display (FPD) ithathe indawo enkulu ye-cathode-ray tube (CRT) -based display computer kanye nemakethe yethelevishini. Kuzophinde kukhuphule kakhulu isidingo sobuchwepheshe kanye nemakethe yezinhloso ze-ITO. Bese kuba nobuchwepheshe bokugcina. Isidingo sokuminyana okuphezulu, amadrayivu aqinile amakhulu namadiski asuleleka aphezulu siyaqhubeka sikhula. Konke lokhu kuholele ekuguqulweni kwesidingo sezinto ezihlosiwe embonini yezicelo. Kokulandelayo, sizokwethula izinkambu ezisemqoka zohlelo okuhloswe ngalo kanye nendlela yokuthuthukisa okuhlosiwe kule mikhakha.
1. I-Microelectronics
Kuzo zonke izimboni zezicelo, imboni ye-semiconductor inezidingo zekhwalithi eziqine kakhulu zamafilimu aqondiswe ku-sputtering. Ama-silicon wafers angama-intshi angu-12 (300 epistaxis) manje akhiqizwa. Ububanzi boxhumano buyehla. Izidingo zabakhiqizi be-silicon wafer bezinto ezihlosiwe ziyizinga elikhulu, ukuhlanzeka okuphezulu, ukuhlukaniswa okuphansi nokusanhlamvu okuhle, okudinga izinto ezihlosiwe ukuthi zibe ne-microstructure engcono. Ububanzi bezinhlayiyana zekristalu nokufana kwento eqondiwe kuye kwabhekwa njengezici ezibalulekile ezithinta izinga lokubekwa kwefilimu.
Uma kuqhathaniswa ne-aluminium, ithusi linokumelana okuphezulu kwe-electromobility kanye ne-resistivity ephansi, engahlangabezana nezidingo zobuchwepheshe be-conductor ku-wiring ye-submicron engaphansi kuka-0.25um, kodwa iletha ezinye izinkinga: amandla aphansi okunamathela phakathi kwethusi nezinto eziphilayo eziphakathi. Ngaphezu kwalokho, kulula ukusabela, okuholela ekulimazeni kokuxhumana kwethusi kanye nokuphulwa kwesifunda ngesikhathi sokusetshenziswa kwe-chip. Ukuze uxazulule le nkinga, ungqimba lokuvimbela kufanele lubekwe phakathi kwethusi nongqimba lwe-dielectric.
Izinto eziqondiwe ezisetshenziswa kungqimba lokuhlangana kwethusi zihlanganisa u-Ta, W, TaSi, WSi, njll. Kodwa u-Ta no-W kuyizinsimbi eziphikisayo. Kunzima ukuwenza, futhi ama-alloys afana ne-molybdenum ne-chromium ayacutshungulwa njengenye into.
2. Okombukiso
I-Flat panel display (FPD) ibe nomthelela omkhulu kumonitha wekhompiyutha esekelwe ku-cathode-ray (CRT) -based based kanye nemakethe yethelevishini phakathi neminyaka edlule, futhi izoqhuba ubuchwepheshe nesidingo semakethe sezinto eziqondiwe ze-ITO. Kunezinhlobo ezimbili zokuhloswe kwe-ITO namuhla. Enye iwukusebenzisa i-nanometer state ye-indium oxide ne-tin oxide powder ngemva kokucwilisa, enye iwukusebenzisa i-indium tin alloy target. Ifilimu ye-ITO ingenziwa i-DC reactive sputtering kuthagethi ye-indium-tin alloy, kodwa indawo eqondiwe izokhipha i-oxidize futhi ithinte izinga lokufafaza, futhi kunzima ukuthola ithagethi yealloy yosayizi omkhulu.
Kulezi zinsuku, indlela yokuqala isetshenziswa ngokujwayelekile ukukhiqiza impahla eqondiwe ye-ITO, okuyi-sputtering coating ngokusabela kwe-magnetron sputtering. Inezinga lokubeka elisheshayo. Ubukhulu befilimu bungalawulwa ngokunembile, i-conductivity iphezulu, ukuvumelana kwefilimu kuhle, futhi ukunamathela kwe-substrate kunamandla. Kodwa into ehlosiwe inzima ukwenza, ngoba i-idium oxide ne-tin oxide akuhlangani ndawonye kalula. Ngokuvamile, i-ZrO2, i-Bi2O3 ne-CeO zikhethwa njengezithasiselo ze-sintering, futhi okokusebenza okuqondiwe okunokuminyana okungu-93%~98% yenani lethiyori kungatholakala. Ukusebenza kwefilimu ye-ITO eyenziwe ngale ndlela kunobudlelwano obuhle nezithasiselo.
Ukuvimbela ukuvinjelwa kwefilimu ye-ITO etholwe ngokusebenzisa izinto ezihlosiwe ezinjalo kufinyelela ku-8.1 × 10n-cm, okuseduze nokuphikiswa kwefilimu ye-ITO ehlanzekile. Ubukhulu be-FPD kanye nengilazi eqhubayo bukhulu impela, futhi ububanzi bengilazi yokuhambisa bungafinyelela ku-3133mm. Ukuze kuthuthukiswe ukusetshenziswa kwezinto eziqondiwe, izinto eziqondiwe ze-ITO ezinomumo ohlukene, njengokuma kwesilinda, ziyathuthukiswa. Ngo-2000, Ikhomishana Kazwelonke Yokuhlela Intuthuko kanye Nomnyango Wesayensi Nobuchwepheshe bafaka imigomo emikhulu ye-ITO Kumihlahlandlela Yezindawo Ezibalulekile Zomkhakha Wolwazi Obekwe Eqhulwini Okwamanje Ukuze Uthuthukiswe.
3. Ukusetshenziswa kwesitoreji
Ngokuphathelene nobuchwepheshe bokugcina, ukuthuthukiswa kwama-hard disks aphezulu kanye nomthamo omkhulu kudinga inani elikhulu lezinto zefilimu zokungafuni ukungafuni. Ifilimu eyinhlanganisela ye-CoF~Cu ye-multilayer iyisakhiwo esisetshenziswa kakhulu sefilimu enkulukazi yokungabaza. I-TbFeCo alloy target material edingekayo ku-magnetic disc isathuthukiswa. Idiski kazibuthe ekhiqizwe nge-TbFeCo inezici zomthamo omkhulu wokugcina, impilo ende yesevisi kanye nokusuleleka okuphindaphindiwe kokungathinteki.
Imemori ye-Antimony germanium telluride based phase change memory (PCM) ibonise amandla amakhulu okuhweba, iba yingxenye ye-NOR flash memory kanye nemakethe ye-DRAM obunye ubuchwepheshe bokugcina, nokho, ekusetshenzisweni kwehliswe ngokushesha enye yezinselelo emgwaqeni ozoba khona ukuntuleka kokusetha kabusha. ukukhiqizwa kwamanje kungenziwa kwehliswe ngokuqhubekayo iyunithi evalwe ngokuphelele. Ukunciphisa ukusetha kabusha kwamanje kunciphisa ukusetshenziswa kwamandla enkumbulo, kunweba impilo yebhethri, futhi kuthuthukisa umkhawulokudonsa wedatha, zonke izici ezibalulekile kumadivayisi anamuhla agxile kudatha, aphatheka kakhulu.
Isikhathi sokuthumela: Aug-09-2022