Inkqubo ebophelelayo yebhodi yangasemva:
1, Yintoni ebophelelayo? Ibhekisa ekusebenziseni i-solder ukuwelda izinto ekujoliswe kuzo kwithagethi yangasemva. Kukho iindlela ezintathu eziphambili: i-crimping, i-brazing, kunye ne-adhesive conductive. Ukubophelela ekujoliswe kuko ngokuqhelekileyo kusetyenziselwa ukubrawuza, kunye nezixhobo zokubrawuza ngokuqhelekileyo ziquka i-In, Sn, kunye ne-In Sn. Ngokuqhelekileyo, xa kusetyenziswa izinto ezithambileyo zokubhobhoza, amandla okutshiza afuneka ukuba abe ngaphantsi kwe-20W/cm2.
2, Kutheni ubophelela 1. Thintela ukuqhekeka okungalinganiyo kwezixhobo ekujoliswe kuzo ngexesha lokufudumeza, njengeethagethi ezinqabileyo ezifana ne-ITO, i-SiO2, iiseramikhi, kunye neethagethi ze-sintered; 2. Gcina * * * kwaye uthintele ukuguqulwa. Ukuba izinto ezijoliswe kuzo zibiza kakhulu, zingenziwa zibe zincinci kwaye ziboshwe kwithagethi yangasemva ukukhusela ukuguqulwa.
I-3, Ukukhethwa kwethagethi yangasemva: 1. Izinto ezityebileyo eziziKhethekileyo Co., Ltd. ngokuqhelekileyo isebenzisa i-oxygen free copper ene-conductivity enhle, kunye ne-thermal conductivity ye-oxygen free copper ingcono kunobhedu olubomvu; 2. Ubukhulu buphakathi, kwaye ngokuqhelekileyo kucetyiswa ukuba ube ne-back target thickness of about 3mm. Ingqindilili kakhulu, idla amandla athile emagnethi; Ibhityile kakhulu, kulula ukuyikhubaza.
4, Inkqubo yokubophelela 1. Phatha umphezulu wento ekujoliswe kuyo kunye nethagethi yangasemva ngaphambi kokubopha. 2. Beka izinto ezijoliswe kuyo kunye nethagethi yangasemva kwiplatifomu yokuqhafaza kwaye uphakamise ubushushu kwiqondo lokushisa lokubopha. 3. Metallisa imathiriyeli ekujoliswe kuyo kunye nethagethi yangasemva. 4. Bond imathiriyeli ekujoliswe kuyo kunye nethagethi yangasemva. 5. Ukupholisa kunye ne-post-processing.
5, Izilumkiso zokusebenzisa iithagethi ezibotshiweyo: 1. Ubushushu be-sputtering kufuneka bungabi phezulu kakhulu. 2. Umsinga kufuneka unyuswe kancinci kancinci. 3. Amanzi okupholisa ajikelezayo kufuneka abe ngaphantsi kwama-35 degrees celsius. 4. Uxinano olufanelekileyo lwethagethi
I-6, Isizathu sokuqhawula i-plate yangasemva kukuba ubushushu be-sputtering buphezulu, kwaye i-back target ixhomekeke kwi-oxidation kunye ne-warping. Izinto ezijoliswe kuzo ziya kuqhekeka ngexesha lokutshiza okuphezulu, okubangela ukuba i-back target ikhuphe; 2. I-current iphezulu kakhulu kwaye i-heat conduction ikhawuleza kakhulu, ibangela ukuba ukushisa kuphakame kakhulu kwaye i-solder iyancibilika, okubangela ukuba i-solder ingalingani kunye ne-detachment ye-target target; 3. Iqondo lokushisa lokuphuma kwamanzi okupholisa okujikelezayo kufuneka libe ngaphantsi kwama-35 degrees Celsius, kwaye ubushushu obuphezulu bamanzi ajikelezayo bunokubangela ukutshatyalaliswa kobushushu kunye nokukhupha; 4. Ubuninzi bezinto ezijoliswe kuyo ngokwazo, xa ubuninzi bezinto ezijoliswe kuzo ziphezulu kakhulu, akulula ukubhengeza, akukho zithuba, kwaye i-back target ilula ukuwa.
Ixesha lokuposa: Oct-12-2023