Ukukhusela iinkqubo zombane ekuphazamisekeni kwe-electromagnetic (EMI) ibe ngumxholo oshushu. Ukuqhubela phambili kwezobuchwepheshe kwimigangatho ye-5G, ukutshaja okungenazintambo kwi-electronics mobile, ukuhlanganiswa kwe-antenna kwi-chassis, kunye nokuqaliswa kweNkqubo kwiPhakeji (i-SiP) kuqhuba isidingo sokukhusela i-EMI engcono kunye nokuhlukaniswa kwiiphakheji zecandelo kunye nezicelo ezinkulu zemodyuli. Ukukhusela ngokusesikweni, imathiriyeli yokhuselo ye-EMI yomphezulu wangaphandle wepakethe idiphozithwa ikakhulu kusetyenziswa iinkqubo zokubeka umphunga (PVD) kusetyenziswa ubuchwepheshe bokupakisha kwangaphambili kwizicelo zokupakisha zangaphakathi. Nangona kunjalo, ubungakanani kunye nemiba yeendleko zobuchwephesha bokutshiza, kunye nokuhambela phambili kwizinto ezityiwayo, zikhokelela ekuqwalaselweni kwezinye iindlela zokutshiza zokukhusela i-EMI.
Ababhali baya kuxoxa ngokuphuhliswa kweenkqubo zokutshiza zokutshiza zokusebenzisa izixhobo zokukhusela i-EMI kwiindawo zangaphandle zamacandelo ahlukeneyo kwimicu kunye neepakethe ezinkulu ze-SiP. Kusetyenziswa imathiriyeli esele ziphuhlisiwe neziphuculweyo zolu shishino, inkqubo ibonakalisiwe ebonelela ngokugqunywa ngokufanayo kwiipakethe ezingaphantsi kwee-microns ezili-10 ubukhulu kunye nokugqunywa okufanayo kwiikona zephakheji kunye neepakethe ezisecaleni. Ubungakanani bodonga olusecaleni 1:1. Uphando olongezelelekileyo lubonise ukuba iindleko zokwenziwa kokusetyenziswa kokhuselo lwe-EMI kwiipakethe zecandelo zingancitshiswa ngokunyusa izinga lokutshiza nangokukhetha ngokukhethayo ukusebenzisa iileya kwiindawo ezithile zephakheji. Ukongeza, ixabiso eliphantsi lenkunzi yezixhobo kunye nexesha elifutshane lokumisela izixhobo zokutshiza xa kuthelekiswa nezixhobo zokutshiza ziphucula amandla okunyusa umthamo wemveliso.
Xa upakisha i-electronics ephathwayo, abanye abavelisi beemodyuli ze-SiP bajongana nengxaki yokwahlula amacandelo ngaphakathi kwe-SiP ukusuka komnye nomnye nangaphandle ukukhusela ekuphazamisekeni kwe-electromagnetic. I-grooves inqunywe malunga namacandelo angaphakathi kwaye i-condutive paste isetyenziswe kwi-grooves ukudala i-Faraday cage encinci ngaphakathi kwecala. Njengoko uyilo lomsele luyancipha, kuyimfuneko ukulawula umthamo kunye nokuchaneka kokubekwa kwezinto ezigcwalisa umsele. Iimveliso zamva nje zokuqhushumba zilawula umthamo kunye nobubanzi obumxinwa bokuhamba komoya buqinisekisa ukugcwaliswa komsele ngokuchanekileyo. Kwinqanaba lokugqibela, imiphezulu yale mijelo igcwaliswe incama idityaniswe kunye ngokusebenzisa i-EMI yangaphandle yokukhusela i-EMI. I-Spray Coating isombulula iingxaki ezinxulumene nokusetyenziswa kwezixhobo zokutshiza kwaye ithatha inzuzo yezinto eziphuculweyo ze-EMI kunye nezixhobo zokubeka, ukuvumela iiphakheji ze-SiP ukuba zenziwe kusetyenziswa iindlela zokupakisha zangaphakathi ezifanelekileyo.
Kwiminyaka yakutshanje, ukukhusela i-EMI kuye kwaba yinkxalabo enkulu. Ngokwamkelwa ngokuthe ngcembe kwethekhnoloji engenazingcingo ye-5G kunye namathuba exesha elizayo ukuba i-5G iya kuzisa kwi-Intanethi yeZinto (IoT) kunye nonxibelelwano olubalulekileyo lobuthunywa, isidingo sokukhusela ngokufanelekileyo amacandelo e-elektroniki kunye neendibano zokuphazamiseka kwe-electromagnetic ziye zanda. kubalulekile. Ngomgangatho ozayo we-5G ongenazintambo, iifrikhwensi zesignali kwi-600 MHz ukuya kwi-6 GHz kunye ne-millimeter wave bands ziya kuba ziqhelekileyo kwaye zibe namandla njengoko iteknoloji yamkelwa. Ezinye iimeko ezicetywayo zokusetyenziswa kunye nokuphunyezwa ziquka iifestile zezakhiwo zeofisi okanye izithuthi zikawonkewonke ukunceda ukugcina unxibelelwano kumgama omfutshane.
Ngenxa yokuba ii-frequencies ze-5G zinobunzima bokungena kwiindonga kunye nezinye izinto ezinzima, ezinye izinto ezicetywayo zokuphunyezwa ziquka abaphindayo kumakhaya kunye nezakhiwo zeofisi ukubonelela ngokufanelekileyo. Zonke ezi zenzo ziya kukhokelela ekwandeni kokuxhaphaka kwemiqondiso kwiibhendi ze-5G frequency kunye nomngcipheko ophezulu wokuvezwa kukuphazamiseka kwe-electromagnetic kula mabhendi amaza kunye nee-harmonics zabo.
Ngethamsanqa, i-EMI inokukhuselwa ngokufaka i-coating yensimbi encinci, eqhubayo kumacandelo angaphandle kunye ne-System-in-Package (SiP) izixhobo (Umfanekiso 1). Ngaphambili, ukhuselo lwe-EMI luye lwasetyenziswa ngokubeka iinkonkxa zetsimbi ezinesitampu malunga namaqela amacandelo, okanye ngokufaka iteyiphu yokukhusela kumacandelo ngamanye. Nangona kunjalo, njengoko iipakethe kunye nezixhobo zokuphela ziqhubeka zisenziwa zincinci, le ndlela yokukhusela ayimkelekanga ngenxa yokulinganiselwa kobungakanani kunye nokuguquguquka kokusingatha iikhonsepthi zeephakheji ezingafaniyo, ezingenayo i-orthogonal eziye zasetyenziswa ngakumbi kwi-mobile kunye ne-elektronikhi yokunxiba.
Ngokunjalo, ezinye iipakethe zoyilo ezikhokelayo zisiya ekugqumeni ngokukhetha kuphela iindawo ezithile zepakethe yokhuselo lwe-EMI, endaweni yokugquma umphandle wonke wepakethe ngephakheji epheleleyo. Ukongeza kwi-EMI yangaphandle yokukhusela, izixhobo ezintsha ze-SiP zifuna ukhuseleko olongezelelweyo olwakhelwe ngaphakathi olwakhiwe ngokuthe ngqo kwipakethe ukuze luhlukanise ngokufanelekileyo amacandelo ahlukeneyo omnye komnye kwiphakheji efanayo.
Eyona ndlela iphambili yokudala ukhuselo lwe-EMI kwiipakethe zecandelo elibunjiweyo okanye izixhobo ezibunjiweyo ze-SiP kukutshiza iileya ezininzi zentsimbi kumphezulu. Ngokufafaza, iingubo ezibhityileyo kakhulu ezifanayo zentsimbi esulungekileyo okanye ialloyi zetsimbi zinokufakwa kumphezulu wepakethe ezinobunzima obuyi-1 ukuya kwi-7 µm. Ngenxa yokuba inkqubo yokutshiza iyakwazi ukubeka isinyithi kwinqanaba le-angstrom, iipropathi zombane zengubo yayo ukuza kuthi ga ngoku sele zisebenza kwizicelo eziqhelekileyo zokhuselo.
Nangona kunjalo, njengoko imfuno yokhuseleko ikhula, ukuchaphaza kunento ebalulekileyo enokuthi ithintele ukuba isetyenziswe njengendlela enokunyuka kubavelisi kunye nabaphuhlisi. Ixabiso lokuqala lenkunzi yezixhobo zokutshiza liphezulu kakhulu, kuluhlu lwezigidi zeerandi. Ngenxa yenkqubo ye-multi-chamber, umgca wesixhobo sokutshiza ufuna indawo enkulu kwaye ukhulise ngakumbi imfuno ye-real estate eyongezelelweyo kunye nenkqubo yokudluliselwa ngokupheleleyo. Iimeko eziqhelekileyo zegumbi le-sputter zingafikelela kuluhlu lwe-400 ° C njengoko i-plasma excitation sputters impahla evela kwi-target target kwi-substrate; ngoko ke, "ipleyiti ebandayo" yokuxhoma iyafuneka ukupholisa i-substrate ukunciphisa amaqondo obushushu afunyenweyo. Ngethuba lenkqubo yokubeka, isinyithi sifakwe kwi-substrate enikeziweyo, kodwa, njengomthetho, ubuninzi bokugquma kweendonga zecala elithe nkqo kwipakethi ye-3D ngokuqhelekileyo ukuya kuma-60% xa kuthelekiswa nobukhulu bomgangatho ophezulu.
Ekugqibeleni, ngenxa yokuba i-sputtering yinkqubo ye-line-of-sight deposition, iinqununu zetsimbi azikwazi ukuzikhethela okanye kufuneka zifakwe phantsi kwezakhiwo ezigqithisiweyo kunye ne-topology, ezinokuthi zikhokelela ekulahlekeni kwezinto ezibonakalayo ngaphezu kokuqokelela ngaphakathi kweendonga zegumbi; ngoko ke, kufuna ulondolozo oluninzi. Ukuba imimandla ethile yesubstrate enikiweyo kufuneka ishiywe ibonakala okanye ukukhuselwa kwe-EMI akuyomfuneko, i-substrate kufuneka ifakwe isigqubuthelo kwangaphambili.
Ukukhusela iinkqubo zombane ekuphazamisekeni kwe-electromagnetic (EMI) ibe ngumxholo oshushu. Ukuqhubela phambili kwezobuchwepheshe kwimigangatho ye-5G, ukutshaja okungenazintambo kwi-electronics mobile, ukuhlanganiswa kwe-antenna kwi-chassis, kunye nokuqaliswa kweNkqubo kwiPhakeji (i-SiP) kuqhuba isidingo sokukhusela i-EMI engcono kunye nokuhlukaniswa kwiiphakheji zecandelo kunye nezicelo ezinkulu zemodyuli. Ukukhusela ngokusesikweni, imathiriyeli yokhuselo ye-EMI yomphezulu wangaphandle wepakethe idiphozithwa ikakhulu kusetyenziswa iinkqubo zokubeka umphunga (PVD) kusetyenziswa ubuchwepheshe bokupakisha kwangaphambili kwizicelo zokupakisha zangaphakathi. Nangona kunjalo, ubungakanani kunye nemiba yeendleko zobuchwephesha bokutshiza, kunye nokuhambela phambili kwizinto ezityiwayo, zikhokelela ekuqwalaselweni kwezinye iindlela zokutshiza zokukhusela i-EMI.
Ababhali baya kuxoxa ngokuphuhliswa kweenkqubo zokutshiza zokutshiza zokusebenzisa izixhobo zokukhusela i-EMI kwiindawo zangaphandle zamacandelo ahlukeneyo kwimicu kunye neepakethe ezinkulu ze-SiP. Kusetyenziswa imathiriyeli esele ziphuhlisiwe neziphuculweyo zolu shishino, inkqubo ibonakalisiwe ebonelela ngokugqunywa ngokufanayo kwiipakethe ezingaphantsi kwee-microns ezili-10 ubukhulu kunye nokugqunywa okufanayo kwiikona zephakheji kunye neepakethe ezisecaleni. Ubungakanani bodonga olusecaleni 1:1. Uphando olongezelelekileyo lubonise ukuba iindleko zokwenziwa kokusetyenziswa kokhuselo lwe-EMI kwiipakethe zecandelo zingancitshiswa ngokunyusa izinga lokutshiza nangokukhetha ngokukhethayo ukusebenzisa iileya kwiindawo ezithile zephakheji. Ukongeza, ixabiso eliphantsi lenkunzi yezixhobo kunye nexesha elifutshane lokumisela izixhobo zokutshiza xa kuthelekiswa nezixhobo zokutshiza ziphucula amandla okunyusa umthamo wemveliso.
Xa upakisha i-electronics ephathwayo, abanye abavelisi beemodyuli ze-SiP bajongana nengxaki yokwahlula amacandelo ngaphakathi kwe-SiP ukusuka komnye nomnye nangaphandle ukukhusela ekuphazamisekeni kwe-electromagnetic. I-grooves inqunywe malunga namacandelo angaphakathi kwaye i-condutive paste isetyenziswe kwi-grooves ukudala i-Faraday cage encinci ngaphakathi kwecala. Njengoko uyilo lomsele luyancipha, kuyimfuneko ukulawula umthamo kunye nokuchaneka kokubekwa kwezinto ezigcwalisa umsele. Iimveliso zamva nje zokuqhushumba zilawula umthamo kunye nobubanzi obumxinwa bokuhamba komoya buqinisekisa ukugcwaliswa komsele ngokuchanekileyo. Kwinqanaba lokugqibela, imiphezulu yale mijelo igcwaliswe incama idityaniswe kunye ngokusebenzisa i-EMI yangaphandle yokukhusela i-EMI. I-Spray Coating isombulula iingxaki ezinxulumene nokusetyenziswa kwezixhobo zokutshiza kwaye ithatha inzuzo yezinto eziphuculweyo ze-EMI kunye nezixhobo zokubeka, ukuvumela iiphakheji ze-SiP ukuba zenziwe kusetyenziswa iindlela zokupakisha zangaphakathi ezifanelekileyo.
Kwiminyaka yakutshanje, ukukhusela i-EMI kuye kwaba yinkxalabo enkulu. Ngokwamkelwa ngokuthe ngcembe kwethekhnoloji engenazingcingo ye-5G kunye namathuba exesha elizayo ukuba i-5G iya kuzisa kwi-Intanethi yeZinto (IoT) kunye nonxibelelwano olubalulekileyo lobuthunywa, isidingo sokukhusela ngokufanelekileyo amacandelo e-elektroniki kunye neendibano zokuphazamiseka kwe-electromagnetic ziye zanda. kubalulekile. Ngomgangatho ozayo we-5G ongenazintambo, iifrikhwensi zesignali kwi-600 MHz ukuya kwi-6 GHz kunye ne-millimeter wave bands ziya kuba ziqhelekileyo kwaye zibe namandla njengoko iteknoloji yamkelwa. Ezinye iimeko ezicetywayo zokusetyenziswa kunye nokuphunyezwa ziquka iifestile zezakhiwo zeofisi okanye izithuthi zikawonkewonke ukunceda ukugcina unxibelelwano kumgama omfutshane.
Ngenxa yokuba ii-frequencies ze-5G zinobunzima bokungena kwiindonga kunye nezinye izinto ezinzima, ezinye izinto ezicetywayo zokuphunyezwa ziquka abaphindayo kumakhaya kunye nezakhiwo zeofisi ukubonelela ngokufanelekileyo. Zonke ezi zenzo ziya kukhokelela ekwandeni kokuxhaphaka kwemiqondiso kwiibhendi ze-5G frequency kunye nomngcipheko ophezulu wokuvezwa kukuphazamiseka kwe-electromagnetic kula mabhendi amaza kunye nee-harmonics zabo.
Ngethamsanqa, i-EMI inokukhuselwa ngokufaka i-coating yensimbi encinci, eqhubayo kumacandelo angaphandle kunye ne-System-in-Package (SiP) izixhobo (Umfanekiso 1). Ngaphambili, ukhuselo lwe-EMI luye lwasetyenziswa ngokubeka iinkonkxa zetsimbi ezinesitampu malunga namaqela amacandelo, okanye ngokufaka iteyiphu yokukhusela kumacandelo athile. Nangona kunjalo, njengoko iipakethe kunye nezixhobo zokugqibela ziqhubeka zenziwe zincinci, le ndlela yokukhusela ayimkelekanga ngenxa yokulinganiselwa kobungakanani kunye nokuguquguquka kokusingatha iindidi zeepakethe ze-non-orthogonal eziye zafunyanwa ngakumbi kwi-mobile and wearable electronics.
Ngokunjalo, ezinye iipakethe zoyilo ezikhokelayo zisiya ekugqumeni ngokukhetha kuphela iindawo ezithile zepakethe yokhuselo lwe-EMI, endaweni yokugquma umphandle wonke wepakethe ngephakheji epheleleyo. Ukongeza kwi-EMI yangaphandle yokukhusela, izixhobo ezintsha ze-SiP zifuna ukhuseleko olongezelelweyo olwakhelwe ngaphakathi olwakhiwe ngokuthe ngqo kwipakethe ukuze luhlukanise ngokufanelekileyo amacandelo ahlukeneyo omnye komnye kwiphakheji efanayo.
Eyona ndlela iphambili yokudala ukhuselo lwe-EMI kwiipakethe zecandelo elibunjiweyo okanye izixhobo ezibunjiweyo ze-SiP kukutshiza iileya ezininzi zentsimbi kumphezulu. Ngokufafaza, iingubo ezibhityileyo kakhulu ezifanayo zentsimbi esulungekileyo okanye ialloyi zetsimbi zinokufakwa kumphezulu wepakethe ezinobunzima obuyi-1 ukuya kwi-7 µm. Ngenxa yokuba inkqubo yokutshiza iyakwazi ukubeka isinyithi kwinqanaba le-angstrom, iipropathi zombane zengubo yayo ukuza kuthi ga ngoku sele zisebenza kwizicelo eziqhelekileyo zokhuselo.
Nangona kunjalo, njengoko imfuno yokhuseleko ikhula, ukuchaphaza kunento ebalulekileyo enokuthi ithintele ukuba isetyenziswe njengendlela enokunyuka kubavelisi kunye nabaphuhlisi. Ixabiso lokuqala lenkunzi yezixhobo zokutshiza liphezulu kakhulu, kuluhlu lwezigidi zeerandi. Ngenxa yenkqubo ye-multi-chamber, umgca wesixhobo sokutshiza ufuna indawo enkulu kwaye ukhulise ngakumbi imfuno ye-real estate eyongezelelweyo kunye nenkqubo yokudluliselwa ngokupheleleyo. Iimeko eziqhelekileyo zegumbi le-sputter zingafikelela kuluhlu lwe-400 ° C njengoko i-plasma excitation sputters impahla evela kwi-target target kwi-substrate; ngoko ke, "ipleyiti ebandayo" yokuxhoma iyafuneka ukupholisa i-substrate ukunciphisa amaqondo obushushu afunyenweyo. Ngethuba lenkqubo yokubeka, isinyithi sifakwe kwi-substrate enikeziweyo, kodwa, njengomthetho, ubuninzi bokugquma kweendonga zecala elithe nkqo kwipakethi ye-3D ngokuqhelekileyo ukuya kuma-60% xa kuthelekiswa nobukhulu bomgangatho ophezulu.
Ekugqibeleni, ngenxa yokuba i-sputtering yinkqubo ye-line-of-sight deposition, iinqununu zetsimbi azikwazi ukukhethwa okanye kufuneka zifakwe phantsi kwezakhiwo ezigqithisiweyo kunye ne-topology, ezinokubangela ukulahlekelwa kwezinto ezibonakalayo ngaphezu kokuqokelela ngaphakathi kweendonga zegumbi; ngoko, ifuna ulondolozo oluninzi. Ukuba imimandla ethile yesubstrate enikiweyo kufuneka ishiywe ibonakala okanye ukukhuselwa kwe-EMI akuyomfuneko, i-substrate kufuneka ifakwe isigqubuthelo kwangaphambili.
Iphepha elimhlophe: Xa ushukuma ukusuka kwimveliso encinci ukuya kwi-assortment enkulu, ukulungelelanisa ukuhanjiswa kweebhetshi ezininzi zeemveliso ezahlukeneyo kubalulekile ekwandiseni imveliso. Usebenziso lomgca ngokubanzi… Jonga iPhepha leNgcaciso
Ixesha lokuposa: Apr-19-2023