1. Indlela yokutshiza ngeMagnetron:
IMagnetron sputtering inokohlulwa ibe yiDC sputtering, medium frequency sputtering kunye neRF sputtering.
A. Umbane wokutshiza we-DC unexabiso eliphantsi kwaye ingxinano yefilim efakiweyo imbi. Ngokuqhelekileyo, iibhetri ze-photothermal zasekhaya kunye ne-thit-film zisetyenziswa ngamandla aphantsi, kwaye i-sputtering target yi-conductive metal target.
B. Amandla okutshiza eRF aphezulu, kwaye into ekujoliswe kuyo yokutshiza inokuba yithagethi engaqhubekiyo okanye ekujoliswe kuyo ekuqhubeni.
C. Ithagethi ye-sputtering yamaza aphakathi ingaba yithagethi ye-ceramic okanye ithagethi yesinyithi.
2. Ukuhlelwa kunye nokusetyenziswa kweethagethi ze-sputtering
Kukho iintlobo ezininzi zeethagethi ze-sputtering, kwaye iindlela zokuhlela ekujoliswe kuzo zahlukile. Ngokwemilo, bahlulwe kwithagethi ende, i-target target kunye nethagethi ejikelezayo; Ngokutsho kokubunjwa, inokwahlulwa ibe yithagethi yensimbi, i-alloy target kunye ne-ceramic compound target; Ngokwemihlaba eyahlukeneyo yesicelo, inokwahlulwa ibe yithagethi enxulumene ne-semiconductor ye-ceramic, ukurekhoda okujoliswe kuko kwe-ceramic ephakathi, iithagethi ze-ceramic zokubonisa, njl. Kule shishini, iithagethi ze-sputtering zisetyenziselwa ukulungiselela iimveliso zefilimu ezifanelekileyo (i-hard disk, intloko yamagnetic, i-optical disc, njl.). Ngoku. Ngophuhliso oluqhubekayo lweshishini lolwazi, imfuno yokurekhodwa kwethagethi ye-ceramic ephakathi kwimarike iyanda. Uphando kunye nokuveliswa kweethagethi eziphakathi kokurekhoda kuye kwaba yingqwalasela ebanzi.
Ixesha lokuposa: May-11-2022