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Codsiga iyo mabda'a bartilmaameedka sputtering

Ku saabsan codsiga iyo mabda'a sputtering tignoolajiyada bartilmaameedka, macaamiisha qaar ayaa la tashaday RSM, hadda dhibaatadan in badan oo ka walaacsan , khubarada farsamada waxay wadaagaan aqoon gaar ah oo la xidhiidha.

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  Codsiga bartilmaameedka ah:

Qaybaha dallacaadda (sida argon ions) waxay duqeeyaan sag adag, taasoo keenaysa qaybo dusha sare, sida atamka, molecules ama xidhmooyinka inay ka baxsadaan dusha shayga ifafaale ee loo yaqaan "sputtering". In daahan magnetron sputtering daahan, ions togan ka mid ah by argon ionization sida caadiga ah loo isticmaalo in lagu duqeeyo adag (bartilmaameedka), iyo atamka dhexdhexaadka ah sputtered waxaa lagu kaydiyaa on substrate (workpiece) si ay u sameeyaan lakabka filim. Daahan Magnetron sputtering wuxuu leeyahay laba sifo: "heerkulka hoose" iyo "dhaqso leh".

  Mabda'a sputtering Magnetron:

Goob magnetic orthogonal ah iyo goob koronto ayaa lagu daraa inta u dhaxaysa tiirka bartilmaameedka ah (cathode) iyo anode-ka, gaaska loo baahan yahay (sida caadiga ah gaaska Ar) ayaa lagu buuxiyaa qolka faakuumka sare. Magnet-ka joogtada ahi waxa uu samaysaa dhul magnetic 250-350 Gauss ah oo ku yaala dusha sare ee walaxda la beegsanayo, waxana uu sameeyaa goob korantada orthogonal oo leh koronto sare.

Marka la eego ficilka beerta korantada, gaaska Ar waxaa loo galiyay ion togan iyo electrons, waxaana jira cadaadis sare oo xun oo gaar ah oo bartilmaameedka ah, sidaa darteed elektaroonnada ka soo baxa cirifka bartilmaameedka ayaa saameeya goobta magnetic iyo itimaalka ionization ee shaqada gaaska ayaa kordha. Plasma-cufnaanta sare ayaa laga sameeyay meel u dhow cathode, iyo Ar ions waxay ku dadajiyaan dusha bartilmaameedka iyada oo la raacayo ficilka Lorentz Force waxayna duqeeyaan dusha sare ee bartilmaameedka, si ay atomyada firdhisan ee bartilmaameedka uga baxsadaan dusha sare ee bartilmaameedka tamarta kinetic oo u duul substrate si aad u sameyso filim iyadoo la raacayo mabda'a isbeddelka xawaaraha.

Tuuritaanka Magnetron guud ahaan waxa loo qaybiyaa laba nooc: sputtering DC iyo RF sputtering. Mabda'a qalabka wax lagu dhufto ee DC waa mid fudud, heerkuna waa dhakhso marka biraha la daadiyo. Isticmaalka sputtering RF waa mid aad u ballaaran, marka lagu daro dhuujinta alaabta wax-qabadka, laakiin sidoo kale xajinta walxaha aan waxtarka lahayn, laakiin sidoo kale diyaarinta xajinta falcelinta ee oxides, nitrides iyo karbides iyo walxaha kale ee isku dhafan. Haddii inta jeer ee RF uu kordho, waxay noqotaa mikrowave plasma sputtering. Waqtigan xaadirka ah, resonance electron cyclotron (ECR) nooca microwave sputtering balasmaha ayaa caadi ahaan loo isticmaalaa.


Waqtiga boostada: Agoosto-01-2022