Sida aynu wada ognahay, hababka caadi ahaan loo isticmaalo daahan vacuum waa vacuum transpiration iyo ion sputtering. Waa maxay farqiga u dhexeeya daahan transpiration iyo daahan sputtering badandadka qabo su'aalahan oo kale. Aan kula wadaagno faraqa u dhexeeya daahan dahaarka ah iyo dahaarka sputtering
Filimka transpiration Vacuum waa in lagu kululeeyo xogta si ay ugu noqoto heerkul go'an iyadoo la adeegsanayo kuleyl iska caabin ah ama alwaax elektaroonig ah iyo duqeymaha laysarka ee deegaanka leh shahaado faakuum ah oo aan ka yarayn 10-2Pa, si tamarta gariirka kulaylka ee molecules ama atamka ku jira xogta ayaa ka badan tamarta ku xidhan ee dusha sare, si ay unugyo ama atamka badani u soo baxaan ama u kordhaan, oo si toos ah ugu shubaan substrate-ka si ay filim u sameeyaan. Daahan Ion sputtering waxay isticmaashaa dhaqdhaqaaqa remonstrance sare ee ion togan oo ay dhaliso gaaska hoos yimaada saamaynta beerta korantada si ay u duqeeyaan bartilmaameedka sida cathode, si ay atamka ama molecules ee bartilmaameedku u baxsadaan oo ay dhigtaan dusha sare ee workpiece taajaysan si ay u sameeyaan. filimka loo baahan yahay.
Habka ugu badan ee loo isticmaalo daahan vacuum transpiration waa habka kuleylka iska caabinta. Faa'iidooyinkeedu waa qaabka fudud ee ilaha kuleylka, kharash yar iyo hawlgal ku habboon. Khasaaraheeda ayaa ah in aysan ku habboonayn biraha refractory iyo warbaahinta heerkulka sare u adkaysta. Kuleyliyaha alwaax koronto iyo kuleyliyaha laysarka ayaa ka gudbi kara faa'iido darrada kululaynta iska caabinta. Kuleyliyaha alwaax elektarooniga ah, laydhka elektarooniga ah ee diirada la saaray ayaa loo isticmaalaa in si toos ah loo kululeeyo xogta qolofka leh, tamarta kinetic ee laydhka elektarooniga ah waxay noqotaa tamar kulayl si ay xogta u gudbiso. Kuleyliyaha Laser-ku wuxuu isticmaalaa laysar awood sare leh sida isha kuleyliyaha, laakiin sababtoo ah qiimaha sare ee leysarka awoodda sare, waxa kaliya oo loo isticmaali karaa tiro yar oo ah shaybaarrada cilmi-baarista.
Xirfadda tuurista way ka duwan tahay xirfadda vacuum transpiration. Tuurtu waxa ay tilmaamaysaa ifafaalaha ka soo yeedhaya qaybo ka mid ah in ay dib ugu soo noqdaan dusha sare ee jidhka, markaas oo atamka ama molecules adag ay ka soo baxaan dusha sare. Qaybaha la sii daayo intooda badan waa atomiga, kaas oo inta badan loo yaqaan atomyada sputtered. Qaybaha daadsan ee loo isticmaalo bartilmaameedyada madaafiicda waxay noqon karaan electrons, ions ama qaybo dhexdhexaad ah. Sababtoo ah ion waa sahlan tahay in la helo tamarta dhaqdhaqaaqa ee loo baahan yahay marka la eego goobta korontada, ions waxaa inta badan loo doortaa sida qaybo qolof ah.
Habka tufaaxdu waxay ku salaysan tahay dareere dhalaalaysa, taas oo ah, ion-sputtering waxay ka yimaadaan dareeraha gaaska. Xirfadaha kala duwan ee wax-soo-saarka waxay leeyihiin habab dhalaaleed oo kala duwan. Diode sputtering DC waxay isticmaashaa dareeraha dhalaalka ee DC; Tufaaxidda Triode waa dheecaan dhalaalaya oo ay taageerto cathode kulul; RF sputtering waxay isticmaashaa dheecaan dhalaalaya RF; Tuuritaanka Magnetron waa dareere dhalaal ah oo ay maamusho goob birlabeed ah oo anular ah.
Marka la barbar dhigo daahan vacuum transpiration, dahaarka sputtering wuxuu leeyahay faa'iidooyin badan. Haddii shay kasta oo la dhuuqi karo, gaar ahaan curiyeyaasha iyo xeryahooda leh barta dhalaalka sare iyo cadaadiska uumiga hooseeya; Isku-xidhka u dhexeeya filimka sputtered iyo substrate waa mid wanaagsan; Cufnaanta filimka sare; Dhumucda filimka waa la xakameyn karaa oo ku celcelintu waa wanaagsan tahay. Khasaaraha ayaa ah in qalabku yahay mid adag oo u baahan qalab koronto-sare ah.
Intaa waxaa dheer, isku darka habka transpiration iyo habka sputtering waa ion plating. Faa'iidooyinka habkani waa adhesion xooggan oo u dhexeeya filimka iyo substrate-ka, heerka sare ee dhigaalka iyo cufnaanta sare ee filimka.
Waqtiga boostada: Meey-09-2022