Magnetron sputtering coating is a new physical vapor coating method, compared with the earlier evaporation coating method, its advantages in many aspects are quite remarkable. As a mature technology, magnetron sputtering has been applied in many fields.
Magnetron sputtering principle:
An orthogonal magnetic field and electric field are added between the sputtered target pole (cathode) and the anode, and the required inert gas (usually Ar gas) is filled in the high vacuum chamber. The permanent magnet forms a 250-350 gaus magnetic field on the surface of the target material, and the orthogonal electromagnetic field is composed with the high voltage electric field. Under the effect of electric field, Ar gas ionization into positive ions and electrons, target and has certain negative pressure, from the target from the pole by the effect of magnetic field and the working gas ionization probability increase, form a high density plasma near the cathode, Ar ion under the action of lorentz force, speed up to fly to the target surface, bombarding target surface at a high speed, The sputtered atoms on the target follow the principle of momentum conversion and fly away from the target surface with high kinetic energy to the substrate deposition film.
Magnetron sputtering is generally divided into two kinds: DC sputtering and RF sputtering. The principle of DC sputtering equipment is simple, and the rate is fast when sputtering metal. The use of RF sputtering is more extensive, in addition to sputtering conductive materials, but also sputtering non-conductive materials, but also reactive sputtering preparation of oxides, nitrides and carbides and other compound materials. If the frequency of RF increases, it becomes microwave plasma sputtering. At present, electron cyclotron resonance (ECR) type microwave plasma sputtering is commonly used.
Magnetron sputtering coating target material:
Metal sputtering target material, coating alloy sputtering coating material, ceramic sputtering coating material, boride ceramic sputtering target materials, carbide ceramic sputtering target material, fluoride ceramic sputtering target material, nitride ceramic sputtering target materials, oxide ceramic target, selenide ceramic sputtering target material, silicide ceramic sputtering target materials, sulfide ceramic sputtering target material, Telluride ceramic sputtering target, other ceramic target, chromium-doped silicon oxide ceramic target (CR-SiO), indium phosphide target (InP), lead arsenide target (PbAs), indium arsenide target (InAs).
Post time: Aug-03-2022