We all know that there are many specifications of sputtering target, which has a wide range of application.The target varieties commonly used in different industries are also different, today let’s come with Beijing Richmat together to learn about the sputtering target industry classification.
一、Definition of sputtering target material
Sputtering is one of the main technologies for preparing thin film materials. It uses the ions generated by ion source to form ion beam with high velocity energy through accelerated aggregation in vacuum.Bombarded solid surface, ions and solid surface atoms have kinetic energy exchange, so that the atoms on the solid surface leave the solid and deposit on the substrate surface, the bombarded solid is the raw material for preparing the sputtering deposited film, known as the sputtering target.
二、Application field classification of sputtering target materials
1、Semiconductor target
(1)Commonly used material:Common targets in this field include tantalum, copper, titanium, aluminum, gold, nickel and other high melting point metals.
(2)Usage：Basically use at the crucial original data of integrated circuit
(3)Functional requirements：The technical requirements on purity, size, integration are high.
2、Target material for planar display
(1)Commonly used material：Targets commonly used in this field include aluminum/copper/molybdenum/nickel/niobium/silicon/chromium, etc.
(2)Usage：This kind of target material is mainly used in various types of large area film of TV and notebook。
(3)Functional requirements：High requirements on purity, large area, uniformity and so on.
3、Targets for solar cells
(1)Commonly used material：Aluminum/copper/Molybdenum/chromium /ITO/Ta targets are commonly used in solar cells.
(2)Usage：Mainly used in “window layer”, barrier layer, electrode and conductive film and other occasions。
(3)Functional requirements：High skill requirement, wide range of use.
4、Target material for information storage
(1)Commonly used material：Information storage commonly used cobalt/nickel/ferroalloy/chromium/tellurium/selenium target materials.
(2)Usage：The target material here is mainly used for the head, middle layer and bottom layer of the cd-rom and CD.
(3)Functional requirements：High storage density and high transmission speed are required.
5、Target material for tool modification
(1)Commonly used material：Tool modification of titanium/zirconium/lattice/chrome-aluminum alloy and other targets.
(2)Usage:It is usually used for appearance enhancement.
(3)Functional requirements：High functional requirements, long service life.
6、Target materials for electronic devices
(1)Commonly used material:Aluminum alloy/silicide targets are commonly used in electronic devices
(2)Usage：Generally used for film resistors and capacitors.
(3)Functional requirements：Small size, stability, low resistance temperature coefficient
Post time: Apr-21-2022