Now more and more users understand the types of targets and its applications,but the subdivision of it may not be very clear. Now let’s RSM engineer share with you some induction of magnetron sputtering targets.
Sputtering target: metal sputtering coating target, alloy sputtering coating target, ceramic sputtering coating target, boride ceramic sputtering target, carbide ceramic sputtering target, fluoride ceramic sputtering target, nitride ceramic sputtering target, oxide ceramic target, selenide ceramic sputtering target, silicide ceramic sputtering target, sulfide ceramic sputtering target, telluride ceramic sputtering target, other ceramic targets, Chromium doped silicon oxide ceramic target (CR SiO), indium phosphide target (INP), lead arsenide target (pbas), indium arsenide target (InAs).
Magnetron sputtering is generally divided into two types: DC sputtering and RF sputtering. The principle of DC sputtering equipment is simple, and its rate is also fast when sputtering metal. RF sputtering is widely used. In addition to sputtering conductive data, it can also sputter non-conductive data. The sputtering target can also be used for reactive sputtering to prepare compound data such as oxides, nitrides and carbides. If the RF frequency increases, it will become microwave plasma sputtering. At present, electron cyclotron resonance (ECR) microwave plasma sputtering is commonly used.
Post time: May-26-2022