The target has a wide market, application area and large development in the future. In order to help you have a better understandment the target functions, here below the RSM engineer will briefly introduce the main functional requirements of the target.
Purity: purity is one of the main functional indicators of the target, because the purity of the target has a great impact on the function of the film. However, in practical application, the purity requirements of the target are also different. For example, with the rapid development of microelectronics industry, the size of silicon wafer is expanded from 6 “to 8″ to 12 “, and the wiring width is reduced from 0.5um to 0.25um, 0.18um or even 0.13um. Previously, 99.995% of the target purity can meet the process requirements of 0.35umic, while the preparation of 0.18um lines requires 99.999% or even 99.9999% of the target purity.
Impurity content: impurities in target solids and oxygen and water vapor in pores are the main pollution sources of deposited films. Targets for different purposes have different requirements for different impurity contents. For example, pure aluminum and aluminum alloy targets used in semiconductor industry have special requirements for alkali metal content and radioactive element content.
Density: in order to reduce the pores in the target solid and improve the function of sputtering film, the target is usually required to have high density. The density of the target not only affects the sputtering rate, but also affects the electrical and optical functions of the film. The higher the target density, the better the function of the film. In addition, the density and strength of the target are improved so that the target can better accept the thermal stress in the sputtering process. Density is also one of the key functional indicators of the target.
Post time: May-20-2022