1.The sputtering target bonding copper backplane will enhanced heat dissipation : In the sputtering process, the target is bombarded by high-energy ions, which will produce a lot of heat. Copper has a very high thermal conductivity (about 400 W/m·K), which quickly conducts the heat of the silver target to the cooling system, thereby maintaining the temperature of the silver target and extending its service life .
2. pvd target bonding cu backplane will increase mechanical strength : the silver target itself is relatively soft, easy to be damaged in the sputtering process. The bonded copper backplane provides additional mechanical support to prevent cracking of the silver target due to uneven thermal expansion, especially when the silver target is thin, and significantly increases its strength and durability .
3.target protection : The copper backplane can protect the sputtering target, reduce the damage in the preparation process, and extend the service life. At the same time, the copper backplane has good chemical stability and can effectively prevent the silver target from being corroded and damaged by external chemical substances .
4.Thin film coating target will improve preparation efficiency : the silver target bound with copper backplane is more convenient and efficient in cutting, etching and grinding operations, which can ensure the precision and accuracy of the operation, so as to improve the preparation efficiency .
Post time: Dec-13-2024