With the increase of market demand, more and more types of sputtering targets are constantly updated. Some are familiar and some are unfamiliar to customers. Now, we would like to share with you what are the types of magnetron sputtering targets.
Sputtering target have the following types: metal sputtering coating target, alloy sputtering coating target, ceramic sputtering coating target, boride ceramic sputtering target, carbide ceramic sputtering target, fluoride ceramic sputtering target, nitride ceramic sputtering target, oxide ceramic target, selenide ceramic sputtering target, silicide ceramic sputtering target, sulfide ceramic sputtering target, telluride ceramic sputtering target, other ceramic targets, Chromium doped silicon oxide ceramic target (CR SiO), indium phosphide target (INP), lead arsenide target (pbas), indium arsenide target (InAs).
Magnetron sputtering is generally divided into two types: DC sputtering and RF sputtering. The principle of DC sputtering equipment is simple, and its rate is also fast when sputtering metal. RF sputtering is widely used. In addition to sputtering conductive data, it can also sputter non-conductive data. At the same time, the sputtering target also carries out reactive sputtering to prepare compound data such as oxides, nitrides and carbides. If the RF frequency increases, it will become microwave plasma sputtering. At present, electron cyclotron resonance (ECR) microwave plasma sputtering is commonly used.
Post time: May-18-2022