The target has many functions and a wide applications in many fields. The new sputtering equipment almost uses powerful magnets to spiral the electrons to accelerate the ionization of argon around the target, which increases the probability of collision between the target and argon ions,
Increase the sputtering rate. Generally, DC sputtering is used for metal coating, while RF communication sputtering is used for non-conductive ceramic magnetic materials. The basic principle is to use glow discharge to hit argon (AR) ions on the surface of the target in vacuum, and the cations in the plasma will accelerate to rush to the negative electrode surface as the splashed material. This impact will make the material of the target fly out and deposit on the substrate to form a film.
In general, there are several features of film coating using the sputtering process:
(1) Metal, alloy or insulator can be made into thin film data.
(2) Under appropriate setting conditions, the film with the same composition can be made from multiple and disordered targets.
(3) The mixture or compound of target material and gas molecules can be made by adding oxygen or other active gases in the discharge atmosphere.
(4) The target input current and sputtering time can be controlled, and it is easy to obtain high-precision film thickness.
(5) It is beneficial to the production of other films.
(6) The sputtered particles are hardly affected by gravity, and the target and substrate can be organized freely.
Post time: May-24-2022