Some customers asked about silicon sputtering targets. Now, colleagues from RSM Technology Department will analyze silicon sputtering targets for you.
Silicon sputtering target is made by sputtering metal from silicon ingot. The target can be manufactured by various processes and methods, including electroplating, sputtering and vapor deposition. Preferred embodiments further provide additional cleaning and etching processes to achieve desired surface conditions. The produced target is highly reflective, with a roughness of less than 500 angstroms and relatively fast burning speed. The film prepared by the silicon target has a low particle number.
Silicon sputtering target is used to deposit thin films on silicon based materials. They are commonly used in display, semiconductor, optical, optical communication and glass coating applications. They are also suitable for etching high-tech components. N-type silicon sputtering targets can be used for different purposes. It is applicable to many fields, including electronics, solar cells, semiconductors and displays.
The silicon sputtering target is a sputtering accessory used for depositing materials on the surface. Usually, it consists of silicon atoms. Sputtering process requires precise amount of material, which may be a great challenge. Using ideal sputtering equipment is the only way to make silicon based components. It is worth noting that the silicon sputtering target is not used in the sputtering process.
Post time: Oct-24-2022