We must be very familiar with the target now, now the target market is also increasing, the following is what ‘s the main performance of sputtering target shared by editor from RSM
The purity
Purity of target material is one of the main performance indexes, because the purity of target material has a great influence on the performance of thin film. However, in practical application, the purity requirements of target materials are not the same. For example, with the rapid development of the microelectronics industry, the silicon chip size has been developed from 6 “, 8 “to 12″, and the wiring width has been reduced from 0.5um to 0.25um,0.18um or even 0.13um. Previously, the purity of 99.995% target material can meet the process requirements of 0.35umIC. The purity of the target material is 99.999% or even 99.9999% for the preparation of 0.18um lines.
Impurity content
The impurities in the target solid and the oxygen and water vapor in the pores are the main pollution sources of film deposition. Target materials for different purposes have different requirements for different impurity content. For example, pure aluminum and aluminum alloy targets used in semiconductor industry have special requirements for the content of alkali metals and radioactive elements.
The density
In order to reduce the porosity in the target solid and improve the performance of the sputtering film, high density of the target is usually required. The density of the target affects not only the sputtering rate but also the electrical and optical properties of the film. The higher the target density, the better the film performance. In addition, increasing the density and strength of the target makes the target better withstand the thermal stress in the sputtering process. Density is also one of the key performance indexes of target.
Grain size and grain size distribution
The target is usually polycrystalline with grain size ranging from micrometer to millimeter. For the same target, the sputtering rate of the target with small grains is faster than that of the target with large grains. The thickness distribution of the films deposited by sputtering target with smaller grain size difference (uniform distribution) is more uniform.
Post time: Aug-04-2022