The target has many effects, and the market development space is large. It is very useful in many fields. Almost all new sputtering equipment use powerful magnets to spiral electrons to accelerate the ionization of argon around the target, resulting in an increase in the probability of collision between the target and argon ions. Now let’s take a look of the role of sputtering target in vacuum coating.
Improve the sputtering rate. Generally, DC sputtering is used for metal coating, while RF AC sputtering is used for non-conductive ceramic magnetic materials. The fundamental principle is to use glow discharge to hit argon (AR) ions on the surface of the target in vacuum, and the cations in the plasma will accelerate to rush to the negative electrode surface as the splashed material. This impact will make the material of the target fly out and deposit on the substrate to form a film.
Generally speaking, there are several characteristics of film coating by sputtering process: (1) metal, alloy or insulator can be made into film data.
(2) Under appropriate setting conditions, the film with the same composition can be made from multiple and disordered targets.
(3) The mixture or compound of target material and gas molecules can be produced by adding oxygen or other active gases in the discharge atmosphere.
(4) The target input current and sputtering time can be controlled, and it is easy to obtain high-precision film thickness.
(5) Compared with other processes, it is conducive to the production of large-area uniform films.
(6) The sputtered particles are almost unaffected by gravity, and the positions of target and substrate can be arranged freely.
Post time: May-17-2022