We all know that sputtering is one of the main technologies for preparing film materials. It uses the ions produced by the ion source to accelerate the aggregation in vacuum to form a high-speed ion beam, bombard the solid surface, and the ions exchange kinetic energy with the atoms on the solid surface, so that the atoms on the solid surface leave the solid and deposit on the substrate surface. The bombarded solid is the raw material for depositing film by sputtering, which is called sputtering target.
Various types of sputtered film materials have been widely used in semiconductor integrated circuits, recording media, planar display, tool and die surface coating and so on.
Sputtering targets are mainly used in electronic and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memories, electronic control equipment, etc; It can also be used in the field of glass coating; It can also be used in wear-resistant materials, high temperature corrosion resistance, high-end decorative products and other industries.
There are many kinds of sputtering targets, and there are different methods for the classification of targets:
According to the composition, it can be divided into metal target, alloy target and ceramic compound target.
According to the shape, it can be divided into long target, square target and round target.
It can be divided into microelectronic target, magnetic recording target, optical disk target, precious metal target, film resistance target, conductive film target, surface modification target, mask target, decorative layer target, electrode target and other targets according to the application field.
According to different applications, it can be divided into semiconductor related ceramic targets, recording medium ceramic targets, display ceramic targets, superconducting ceramic targets and giant magnetoresistance ceramic targets.
Post time: Jul-29-2022