As we all know, there are many specifications of sputtering targets, and their application fields are also very wide. The types of targets commonly used in different fields are also different. Today, let’s learn about the classification of sputtering target application fields with the editor of RSM!
1、 Definition of sputtering target
Sputtering is one of the main technologies for preparing thin film materials. It uses the ions produced by the ion source to accelerate and gather in vacuum to form a high-speed ion beam, bombard the solid surface, and the ions exchange kinetic energy with the atoms on the solid surface, so that the atoms on the solid surface are separated from the solid and deposited on the substrate surface. The bombarded solid is the raw material for preparing the thin film deposited by sputtering, which is called sputtering target.
2、 Classification of sputtering target application fields
1. Semiconductor target
(1) Common targets: common targets in this field include high melting point metals such as tantalum / copper / titanium / aluminum / gold / nickel.
(2) Usage: mainly used as key raw materials for integrated circuits.
(3) Performance requirements: high technical requirements for purity, size, integration, etc.
2. Target for flat panel display
(1) Common targets: common targets in this field include aluminum / copper / molybdenum / nickel / Niobium / silicon / chromium, etc.
(2) Usage: this kind of target is mostly used for various types of large-area films such as TVs and notebooks.
(3) Performance requirements: high requirements for purity, large area, uniformity, etc.
3. Target material for solar cell
(1) Common targets: aluminum / copper / molybdenum / chromium /ITO/Ta and other targets for solar cells.
(2) Usage: mainly used in “window layer”, barrier layer, electrode and conductive film.
(3) Performance requirements: high technical requirements and wide application range.
4. Target for information storage
(1) Common targets: common targets of cobalt / nickel / ferroalloy / chromium / tellurium / selenium and other materials for information storage.
(2) Usage: this kind of target material is mainly used for the magnetic head, middle layer and bottom layer of optical drive and optical disc.
(3) Performance requirements: high storage density and high transmission speed are required.
5. Target for tool modification
(1) Common targets: common targets such as titanium / zirconium / chromium aluminum alloy modified by tools.
(2) Usage: usually used for surface strengthening.
(3) Performance requirements: high performance requirements and long service life.
6. Targets for electronic devices
(1) Common targets: common aluminum alloy / silicide targets for electronic devices
(2) Purpose: generally used for thin film resistors and capacitors.
(3) Performance requirements: small size, stability, low resistance temperature coefficient
Post time: Jul-27-2022