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MoCu Sputtering Target High Purity Angiangi Film Pvd paninga Ritenga Hanga

Molybdenum Copper

Whakaahuatanga Poto:

Kāwai

Whāinga Sputtering Alloy

Tātai matū

MoCu

Te tito

Molybdenum Copper

Maamaa

99.9%,99.95%,99.99%

Hanga

Pereti , Whangahanga Tiwae , arc cathodes , Ritenga-hanga

Tukanga Whakaputa

PM

Rahi Wātea

L≤200mm,W≤200mm


Taipitopito Hua

Tohu Hua

Molybdenum Copper sputtering target is fabricated by means of infiltration sintering: Molybdenum powders sintered and made into the semi-finished products, combed with a next microwave-assisted aqueous solution. Ko te koranu Molybdenum Copper he tino pai nga ahuatanga o te tinana me te miihini: te pai o te kawe hiko me te waiariki, te iti me te whakatika whakarea o te roha waiariki, te aukati kakahu, me te kaha teitei o te pāmahana.

Tito (%)

Cu

Mo

poke (%)

MoCu10

10±2

Taurite

≤0.1

MoCu15

15±3

Taurite

≤0.1

MoCu20

20±3

Taurite

≤0.1

MoCu25

25±3

Taurite

≤0.1

MoCu40

40±5

Taurite

≤0.1

Ko nga Taonga Taonga Motuhake he tohungatanga ki te Hanganga o te Sputtering Target a ka taea e ia te whakaputa Molybdenum Copper Sputtering Materials e ai ki nga whakaritenga a nga Kaihokohoko. Mo etahi atu korero, tena koa whakapiri mai ki a maatau.


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