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Gịnị bụ sputter target material

Mkpuchi sputtering Magnetron bụ usoro mkpuchi ikuku anụ ahụ ọhụrụ, ma e jiri ya tụnyere usoro mkpuchi evaporation nke mbụ, uru ya n'ọtụtụ akụkụ dị ịrịba ama. Dịka teknụzụ tozuru oke, etinyere sputtering magnetron n'ọtụtụ mpaghara.

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  Ụkpụrụ sputtering Magnetron:

A na-agbakwunye oghere ndọta orthogonal na mpaghara eletrik n'etiti oghere ebumnuche sputtered (cathode) na anode, na gas inert achọrọ (na-abụkarị Ar gas) na-ejupụta n'ọnụ ụlọ dị elu. Ihe ndọta na-adịgide adịgide na-etolite oghere magnetik gaus 250-350 n'elu ihe a na-achọsi ike, na mpaghara electromagnetic orthogonal na-eji igwe eletrik dị elu mejupụtara. N'okpuru mmetụta nke electric ubi, Ar gas ionization n'ime nti ion na electrons, lekwasịrị anya na nwere ụfọdụ adịghị mma nrụgide, si lekwasịrị si osisi site mmetụta nke magnetik na-arụ ọrụ gas ionization probability abawanye, na-etolite a elu njupụta plasma nso cathode, Ar ion n'okpuru omume nke lorentz ike, na-agba ọsọ iji fega n'elu ebe a na-eche nche, na-atụ bọmbụ elu na oke ọsọ ọsọ, Atọm ndị na-agbapụta na ebumnuche na-agbaso ụkpụrụ nke ntụgharị ọkụ ọkụ na fega n'elu nke a na-achọsi ike na ike kinetic dị elu gaa na ihe nkiri ntinye mkpụrụ osisi.

A na-ekekarị sputtering Magnetron ụzọ abụọ: sputtering DC na RF sputtering. Ụkpụrụ nke akụrụngwa sputter DC dị mfe, na ọnụego dị ngwa ngwa mgbe ị na-agbapụta ígwè. Ojiji nke RF sputtering ka ukwuu, na mgbakwunye na ịgbasa ihe na-eduzi, kamakwa na-efesa ihe ndị na-adịghị arụ ọrụ, kamakwa nkwadebe sputtering nke oxides, nitrides na carbides na ihe ndị ọzọ mejupụtara. Ọ bụrụ na ugboro nke RF na-abawanye, ọ na-aghọ ngwa ndakwa nri plasma sputtering. Ka ọ dị ugbu a, a na-ejikarị ikuku plasma sputtering ụdị eletrọn cyclotron resonance (ECR).

  Magnetron sputtering mkpuchi ihe ebumnuche ebumnuche:

Metal sputtering ihe, mkpuchi alloy sputtering mkpuchi ihe, seramiiki sputtering ihe mkpuchi, boride seramiiki sputtering lekwasịrị ihe, carbide seramiiki sputtering lekwasịrị ihe onwunwe, fluoride seramiiki sputtering lekwasịrị ihe onwunwe, nitride seramiiki sputtering lekwasịrị ihe, oxide seramiiki lekwasịrị, selenide seramiiki sputtering ihe, silicide seramiiki sputtering ihe ebumnuche, sulfide seramiiki sputtering ihe ebumnuche, Telluride seramiiki sputtering lekwasịrị anya, ebumnuche seramiiki ndị ọzọ, chromium-doped silicon oxide ceramic target (CR-SiO), indium phosphide target (InP), ebumnuche arsenide (PbAs), ebumnuche indium arsenide (InAs).


Oge nzipu: Ọgọst-03-2022