Koulye a, pi plis itilizatè yo konprann ki kalite objektif akaplikasyon li yo, men sibdivizyon li ka pa trè klè. Koulye a, kite aRSM enjenyè pataje avèk oukèk endiksyon de magnetron sputtering sib.
Sputtering sib: metal sputtering kouch sib, alyaj sputtering kouch sib, seramik sputtering kouch sib, boride seramik sib sputtering, sib carbure seramik sputtering, sib fliyò seramik sputtering, sib nitrid seramik sputtering, sib seramik oksid, selenide seramik sib silisid, sib, sulfid seramik sputtering sib, telluride seramik sib sputtering, lòt sib seramik, Chromium dope Silisyòm oksid seramik sib (CR SiO), sib Indium phosphide (INP), sib arsenide plon (pbas), sib arsenide Endyòm (InAs).
Magnetron sputtering jeneralman divize an de kalite: sputtering DC ak sputtering RF. Prensip la nan ekipman DC sputtering se senp, ak pousantaj li yo tou vit lè sputtering metal. Se RF sputtering lajman itilize. Anplis sputtering done konduktif, li kapab tou sputter done ki pa kondiktif. Sib sputtering la kapab tou itilize pou sputtering reyaktif pou prepare done konpoze tankou oksid, nitrur ak karbid. Si frekans RF a ogmante, li pral tounen sputtering plasma mikwo ond. Kounye a, yo souvan itilize mikwo ond mikwo ond sonorite siklotron elèktron (ECR).
Tan poste: Me-26-2022