Txais tos rau peb lub vev xaib!

Sputtering Targets qeb faib los ntawm Magnetron Sputtering Technology

Nws tuaj yeem muab faib ua DC magnetron sputtering thiab RF magnetron sputtering.

 

DC sputtering txoj kev xav kom lub hom phiaj tuaj yeem hloov cov nqi zoo uas tau txais los ntawm cov txheej txheem ion foob pob mus rau cathode nyob rau hauv kev sib cuag nrog nws, thiab tom qab ntawd txoj kev no tuaj yeem tsuas yog sputter cov ntaub ntawv tus neeg xyuas pib, uas tsis haum rau cov ntaub ntawv rwb thaiv tsev, vim hais tias cov txheej txheem no tsuas yog sputtering tus neeg xyuas pib cov ntaub ntawv. ion nqi ntawm qhov chaw tsis tuaj yeem tsis tuaj yeem nruab nrab thaum foob pob hluav taws xob lub hom phiaj, uas yuav ua rau muaj peev xwm nce ntawm lub peev xwm ntawm lub hom phiaj, thiab yuav luag txhua qhov kev siv hluav taws xob yog siv rau lub hom phiaj, yog li muaj feem cuam tshuam ntawm ion. acceleration thiab ionization ntawm ob tug ncej yuav raug txo, los yog txawm tsis tuaj yeem ionized, Nws ua rau tsis ua hauj lwm ntawm kev tawm mus tas li, txawm tias tawm kev cuam tshuam thiab kev cuam tshuam sputtering. Yog li ntawd, xov tooj cua zaus sputtering (RF) yuav tsum tau siv rau insulating lub hom phiaj los yog non-metallic lub hom phiaj uas tsis zoo conductivity.

Cov txheej txheem sputtering suav nrog cov txheej txheem tawg thiab ntau cov txheej txheem hloov hluav taws xob: ua ntej, qhov xwm txheej sib tsoo elastically nrog lub hom phiaj atoms, thiab ib feem ntawm lub zog kinetic ntawm qhov xwm txheej yuav raug xa mus rau lub hom phiaj atoms. Lub zog kinetic ntawm qee lub hom phiaj atoms tshaj qhov muaj peev xwm thaiv kev tsim los ntawm lwm cov atoms nyob ib puag ncig lawv (5-10ev rau cov hlau), thiab tom qab ntawd lawv tau khob tawm ntawm lub lattice lattice lattice los tsim cov atoms tawm ntawm qhov chaw, thiab txuas ntxiv kev sib tsoo nrog cov atoms uas nyob ib sab. , ua rau muaj kev sib tsoo cascade. Thaum qhov kev sib tsoo no nce mus txog qhov chaw ntawm lub hom phiaj, yog tias lub zog kinetic ntawm cov atoms ze rau ntawm lub hom phiaj yog ntau dua li qhov sib txuas ntawm lub zog (1-6ev rau cov hlau), cov atoms yuav cais tawm ntawm lub hom phiaj. thiab nkag mus rau hauv lub tshuab nqus tsev.

Sputtering txheej yog cov txuj ci ntawm kev siv cov khoom siv hluav taws xob txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau tawg. Feem ntau, qhov qis-siab inert gas glow tawm yog siv los tsim qhov xwm txheej ions. Lub hom phiaj cathode yog ua los ntawm cov ntaub ntawv txheej, lub substrate yog siv raws li anode, 0.1-10pa argon los yog lwm yam inert gas yog nkag mus rau hauv lub tshuab nqus tsev chamber, thiab glow paug tshwm sim nyob rau hauv qhov kev txiav txim ntawm cathode (lub hom phiaj) 1-3kv DC tsis zoo siab. voltage los yog 13.56MHz RF voltage. Ionized argon ions foob pob rau saum npoo ntawm lub hom phiaj, ua rau lub hom phiaj atoms txaws thiab sib sau rau ntawm cov substrate los ua ib zaj duab xis nyias. Tam sim no, muaj ntau txoj kev sputtering, feem ntau suav nrog kev sib txuas lus thib ob, tertiary lossis quaternary sputtering, magnetron sputtering, phiaj sputtering, RF sputtering, bias sputtering, asymmetric kev sib txuas lus RF sputtering, ion beam sputtering thiab reactive sputtering.

Vim hais tias cov atoms sputtered yog splashed tawm tom qab sib pauv kinetic zog nrog zoo ions nrog kaum ntawm electron volts zog, lub sputtered atoms muaj lub zog siab, uas yog tsim nyog rau kev txhim kho lub dispersion muaj peev xwm ntawm atoms thaum stacking, txhim kho lub fineness ntawm stacking kev, thiab ua. cov zaj duab xis npaj muaj zog adhesion nrog lub substrate.

Thaum lub sij hawm sputtering, tom qab cov roj yog ionized, cov roj ions ya mus rau lub hom phiaj txuas nrog lub cathode nyob rau hauv qhov kev txiav txim ntawm hluav taws xob teb, thiab cov electrons ya mus rau hauv av phab ntsa kab noj hniav thiab substrate. Nyob rau hauv txoj kev no, nyob rau hauv qis voltage thiab tsis tshua muaj siab, tus naj npawb ntawm ions yog me me thiab lub sputtering zog ntawm lub hom phiaj yog tsawg; Ntawm qhov hluav taws xob siab thiab siab siab, txawm hais tias muaj ntau ions tuaj yeem tshwm sim, cov hluav taws xob ya mus rau lub substrate muaj lub zog siab, uas yooj yim rau cua sov lub substrate thiab txawm tias qhov thib ob sputtering, cuam tshuam rau cov yeeb yaj kiab zoo. Tsis tas li ntawd, qhov tshwm sim ntawm kev sib tsoo ntawm lub hom phiaj atoms thiab cov roj molecules nyob rau hauv cov txheej txheem ntawm ya mus rau lub substrate kuj yog heev nce. Yog li ntawd, nws yuav tawg mus rau tag nrho cov kab noj hniav, uas yuav tsis tsuas nkim lub hom phiaj, tab sis kuj pollute txhua txheej thaum lub sij hawm npaj ntawm multilayer films.

Txhawm rau daws cov teeb meem saum toj no, DC magnetron sputtering thev naus laus zis tau tsim nyob rau xyoo 1970. Nws zoo overcomes qhov shortcomings ntawm tsawg cathode sputtering tus nqi thiab qhov nce ntawm substrate kub los ntawm electrons. Yog li ntawd, nws tau raug tsim los sai thiab dav siv.

Lub hauv paus ntsiab lus yog raws li nram no: nyob rau hauv magnetron sputtering, vim hais tias cov electrons txav mus rau Lorentz quab yuam nyob rau hauv lub magnetic teb, lawv cov kev taw qhia orbit yuav tortuous los yog spiral motion, thiab lawv txoj kev txav yuav ntev dua. Yog li ntawd, tus naj npawb ntawm kev sib tsoo nrog cov roj molecules ua haujlwm tau nce ntxiv, kom cov ntshav plasma nce ntxiv, thiab tom qab ntawd tus nqi magnetron sputtering tau zoo heev, thiab nws tuaj yeem ua haujlwm nyob rau hauv qis dua sputtering voltage thiab siab kom txo tau cov kev nyiam ntawm zaj duab xis muaj kuab paug; Ntawm qhov tod tes, nws kuj tseem txhim kho lub zog ntawm atoms tshwm sim ntawm qhov chaw ntawm lub substrate, yog li qhov zoo ntawm zaj duab xis tuaj yeem txhim kho kom zoo. Nyob rau tib lub sijhawm, thaum cov hluav taws xob uas poob lub zog los ntawm ntau qhov kev sib tsoo mus txog qhov anode, lawv tau dhau los ua cov hluav taws xob qis, thiab tom qab ntawd lub substrate yuav tsis overheat. Yog li, magnetron sputtering muaj qhov zoo ntawm "kev kub ceev" thiab "tsis kub". Qhov tsis zoo ntawm txoj kev no yog tias cov yeeb yaj kiab insulator tsis tuaj yeem npaj tau, thiab qhov tsis sib xws ntawm cov hlau nplaum siv hauv cov hlau nplaum electrode yuav ua rau pom tseeb qhov tsis sib xws ntawm lub hom phiaj, ua rau kev siv qis ntawm lub hom phiaj, uas feem ntau tsuas yog 20% ​​- 30. %.


Post lub sij hawm: May-16-2022