Tiv thaiv cov tshuab hluav taws xob los ntawm electromagnetic cuam tshuam (EMI) tau dhau los ua lub ntsiab lus kub. Kev tsim kho thev naus laus zis hauv 5G cov qauv, kev them nyiaj wireless rau lub xov tooj ntawm tes hluav taws xob, kav hlau txais xov kev sib koom ua ke rau hauv lub chassis, thiab kev taw qhia ntawm System in Package (SiP) yog tsav qhov xav tau kom zoo dua EMI shielding thiab kev cais tawm hauv cov pob khoom thiab cov ntawv thov loj dua. Rau conformal shielding, EMI shielding cov ntaub ntawv rau sab nrauv ntawm lub pob yog tsuas yog tso siv lub cev vapor deposition (PVD) cov txheej txheem siv prepackaging technology rau kev ntim khoom. Txawm li cas los xij, qhov teeb meem loj thiab nqi ntawm cov cuab yeej tshuaj tsuag, nrog rau kev nce qib hauv cov khoom siv, yog ua rau kev txiav txim siab ntawm lwm txoj kev tshuaj tsuag rau EMI shielding.
Cov kws sau ntawv yuav tham txog kev txhim kho cov txheej txheem tshuaj tsuag rau kev siv EMI shielding cov ntaub ntawv rau sab nrauv ntawm cov khoom ntawm ib tus strips thiab cov pob SiP loj dua. Siv cov ntaub ntawv tsim kho tshiab thiab txhim kho thiab cov khoom siv rau kev lag luam, cov txheej txheem tau pom tias muab kev tiv thaiv ib puag ncig ntawm cov pob ntawv tsawg dua 10 microns tuab thiab tsis sib xws nyob ib puag ncig pob pob thiab pob pob. Sab phab ntsa thickness ratio 1: 1. Kev tshawb fawb ntxiv tau pom tias tus nqi tsim khoom siv EMI shielding rau cov pob khoom tuaj yeem raug txo los ntawm kev nce cov tshuaj tsuag thiab xaiv cov txheej txheem rau cov chaw tshwj xeeb ntawm pob. Tsis tas li ntawd, tus nqi qis ntawm cov cuab yeej siv thiab lub sij hawm luv luv rau cov cuab yeej siv tshuaj tsuag piv rau cov cuab yeej siv tshuaj txau txhim kho lub peev xwm ua kom muaj peev xwm ntau lawm.
Thaum ntim cov khoom siv hluav taws xob txawb, qee cov tuam txhab ntawm SiP modules ntsib teeb meem ntawm kev cais cov khoom hauv SiP los ntawm ib leeg thiab sab nraud los tiv thaiv kev cuam tshuam electromagnetic. Cov grooves raug txiav nyob ib ncig ntawm cov khoom siv sab hauv thiab cov khoom siv hluav taws xob yog siv rau cov grooves los tsim ib lub tawb me me Faraday hauv rooj plaub. Raws li tus qauv tsim trench nqaim, nws yog ib qho tsim nyog los tswj lub ntim thiab qhov tseeb ntawm qhov chaw ntawm cov khoom ntim cov trench. Qhov tseeb tshaj plaws blasting khoom tswj ntim thiab nqaim airflow dav kom meej trench filling. Nyob rau hauv cov kauj ruam kawg, cov saum toj kawg nkaus ntawm cov muab tshuaj txhuam trenches yog glued ua ke los ntawm kev siv ib tug sab nraud EMI shielding txheej. Txau Txheej daws cov teeb meem cuam tshuam nrog kev siv cov khoom siv sputtering thiab siv qhov zoo dua ntawm EMI cov ntaub ntawv thiab cov khoom tso tawm, tso cai rau SiP pob khoom tsim los siv cov txheej txheem ntim khoom zoo.
Nyob rau hauv xyoo tas los no, EMI shielding tau dhau los ua kev txhawj xeeb loj. Nrog rau kev hloov pauv loj ntawm 5G wireless thev naus laus zis thev naus laus zis thiab lub sijhawm yav tom ntej uas 5G yuav coj mus rau Is Taws Nem ntawm Yam (IoT) thiab kev sib txuas lus tseem ceeb, qhov xav tau los tiv thaiv cov khoom siv hluav taws xob zoo thiab kev sib dhos los ntawm kev cuam tshuam hluav taws xob tau nce. qhov tseem ceeb. Nrog rau 5G wireless tus qauv yuav los tom ntej, teeb liab zaus hauv 600 MHz txog 6 GHz thiab millimeter yoj bands yuav dhau los ua ntau dua thiab muaj zog raws li kev siv tshuab. Qee qhov kev thov siv thiab kev siv suav nrog lub qhov rais panes rau cov tsev ua haujlwm lossis kev thauj mus los rau pej xeem los pab kom muaj kev sib txuas lus luv luv.
Vim tias 5G zaus muaj teeb meem nkag mus rau phab ntsa thiab lwm yam khoom nyuaj, lwm qhov kev thov siv suav nrog cov neeg rov ua dua hauv tsev thiab cov tsev ua haujlwm kom muaj kev pab txaus. Tag nrho cov kev ua no yuav ua rau muaj kev nce ntxiv ntawm cov teeb liab hauv 5G zaus bands thiab muaj kev pheej hmoo siab dua ntawm kev cuam tshuam ntawm electromagnetic cuam tshuam hauv cov zaus bands thiab lawv cov harmonics.
Hmoov zoo, EMI tuaj yeem tiv thaiv los ntawm kev siv cov hlau nyias nyias rau cov khoom siv sab nraud thiab System-in-Package (SiP) cov khoom siv (Daim duab 1). Yav dhau los, EMI shielding tau siv los ntawm kev tso cov kaus poom hlau nyob ib ncig ntawm pawg ntawm cov khoom, lossis los ntawm kev siv cov ntaub thaiv npog rau ib tus neeg. Txawm li cas los xij, raws li cov pob khoom thiab cov khoom siv kawg txuas ntxiv mus rau qhov me me, qhov kev tiv thaiv kev tiv thaiv no yuav ua tsis tau vim qhov kev txwv loj thiab qhov yooj yim los tswj cov kev sib txawv, tsis yog orthogonal pob cov ntsiab lus uas tau siv ntau dua hauv cov khoom siv hluav taws xob thiab khoom siv hluav taws xob.
Ib yam li ntawd, qee cov qauv tsim pob tau txav mus rau kev xaiv tsuas yog qee qhov chaw ntawm pob rau EMI shielding, tsis yog npog tag nrho sab nrauv ntawm pob nrog tag nrho pob. Ntxiv nrog rau kev tiv thaiv sab nraud EMI, SiP cov cuab yeej tshiab yuav tsum muaj kev tiv thaiv kev tiv thaiv ntxiv rau hauv lub pob kom raug cais tawm ntau yam ntawm ib leeg hauv tib lub pob.
Txoj hauv kev tseem ceeb rau kev tsim EMI tiv thaiv ntawm cov khoom siv molded los yog molded SiP cov cuab yeej yog tshuaj tsuag ntau txheej hlau rau saum npoo. Los ntawm sputtering, nyias nyias txheej txheej ntawm cov hlau ntshiab lossis hlau alloys tuaj yeem tso rau ntawm pob qhov chaw nrog lub thickness ntawm 1 txog 7 µm. Vim hais tias cov txheej txheem sputtering muaj peev xwm muab cov hlau tso rau ntawm qib angstrom, cov khoom hluav taws xob ntawm nws cov txheej txheem kom deb li deb tau ua haujlwm zoo rau daim ntawv thov kev tiv thaiv.
Txawm li cas los xij, raws li qhov xav tau kev tiv thaiv loj hlob tuaj, sputtering muaj qhov cuam tshuam loj heev uas tiv thaiv nws los ntawm kev siv los ua ib txoj hauv kev loj hlob rau cov tuam txhab thiab cov tsim tawm. Tus nqi pib ntawm cov khoom siv tshuaj tsuag yog siab heev, nyob rau hauv ntau lab nyiaj daus las. Vim yog cov txheej txheem ntau lub chamber, cov khoom siv tshuaj tsuag yuav tsum muaj thaj tsam loj thiab ntxiv qhov kev xav tau ntxiv rau vaj tse ntxiv nrog rau kev hloov pauv tag nrho. Hom sputter chamber tej yam kev mob tuaj yeem ncav cuag 400 ° C ntau yam raws li cov plasma excitation sputters cov khoom los ntawm lub hom phiaj sputter mus rau substrate; Yog li ntawd, yuav tsum tau "txias phaj" mounting fixture kom txias lub substrate kom txo tau qhov kub thiab txias. Thaum lub sij hawm deposition txheej txheem, cov hlau yog muab tso rau ntawm ib tug muab substrate, tab sis, raws li txoj cai, txheej thickness ntawm ntsug sab phab ntsa ntawm ib tug 3D pob yog feem ntau mus txog 60% piv rau lub thickness ntawm lub sab sauv txheej.
Thaum kawg, vim qhov tseeb tias sputtering yog txoj kab ntawm qhov pom kev tso tawm, cov khoom hlau tsis tuaj yeem xaiv los yog yuav tsum tau muab tso rau hauv cov txheej txheem overhanging thiab topologies, uas tuaj yeem ua rau cov khoom tseem ceeb poob ntxiv rau nws cov tsub zuj zuj hauv cov phab ntsa chamber; yog li, nws yuav tsum tau kho ntau heev. Yog tias qee qhov chaw ntawm lub substrate yuav tsum tau tawm sab laug lossis EMI shielding tsis tas yuav tsum tau, lub substrate kuj yuav tsum tau npog ua ntej.
Tiv thaiv cov tshuab hluav taws xob los ntawm electromagnetic cuam tshuam (EMI) tau dhau los ua lub ntsiab lus kub. Kev tsim kho thev naus laus zis hauv 5G cov qauv, kev them nyiaj wireless rau lub xov tooj ntawm tes hluav taws xob, kav hlau txais xov kev sib koom ua ke rau hauv lub chassis, thiab kev taw qhia ntawm System in Package (SiP) yog tsav qhov xav tau kom zoo dua EMI shielding thiab kev cais tawm hauv cov pob khoom thiab cov ntawv thov loj dua. Rau conformal shielding, EMI shielding cov ntaub ntawv rau sab nrauv ntawm lub pob yog tsuas yog tso siv lub cev vapor deposition (PVD) cov txheej txheem siv prepackaging technology rau kev ntim khoom. Txawm li cas los xij, qhov teeb meem loj thiab nqi ntawm cov cuab yeej tshuaj tsuag, nrog rau kev nce qib hauv cov khoom siv, yog ua rau kev txiav txim siab ntawm lwm txoj kev tshuaj tsuag rau EMI shielding.
Cov kws sau ntawv yuav tham txog kev txhim kho cov txheej txheem tshuaj tsuag rau kev siv EMI shielding cov ntaub ntawv rau sab nrauv ntawm cov khoom ntawm ib tus strips thiab cov pob SiP loj dua. Siv cov ntaub ntawv tsim kho tshiab thiab txhim kho thiab cov khoom siv rau kev lag luam, cov txheej txheem tau pom tias muab kev tiv thaiv ib puag ncig ntawm cov pob ntawv tsawg dua 10 microns tuab thiab tsis sib xws nyob ib puag ncig pob pob thiab pob pob. Sab phab ntsa thickness ratio 1: 1. Kev tshawb fawb ntxiv tau pom tias tus nqi tsim khoom siv EMI shielding rau cov pob khoom tuaj yeem raug txo los ntawm kev nce cov tshuaj tsuag thiab xaiv cov txheej txheem rau cov chaw tshwj xeeb ntawm pob. Tsis tas li ntawd, tus nqi qis ntawm cov cuab yeej siv thiab lub sij hawm luv luv rau cov cuab yeej siv tshuaj tsuag piv rau cov cuab yeej siv tshuaj txau txhim kho lub peev xwm ua kom muaj peev xwm ntau lawm.
Thaum ntim cov khoom siv hluav taws xob txawb, qee cov tuam txhab ntawm SiP modules ntsib teeb meem ntawm kev cais cov khoom hauv SiP los ntawm ib leeg thiab sab nraud los tiv thaiv kev cuam tshuam electromagnetic. Cov grooves raug txiav nyob ib ncig ntawm cov khoom siv sab hauv thiab cov khoom siv hluav taws xob yog siv rau cov grooves los tsim ib lub tawb me me Faraday hauv rooj plaub. Raws li tus qauv tsim trench nqaim, nws yog qhov tsim nyog los tswj qhov ntim thiab qhov tseeb ntawm qhov chaw ntawm cov khoom ntim cov trench. Qhov tseeb tshaj plaws blasting khoom tswj ntim thiab nqaim airflow dav kom meej meej trench filling. Nyob rau hauv cov kauj ruam kawg, cov saum toj kawg nkaus ntawm cov muab tshuaj txhuam trenches yog glued ua ke los ntawm kev siv ib tug sab nraud EMI shielding txheej. Txau Txheej daws cov teeb meem cuam tshuam nrog kev siv cov khoom siv sputtering thiab siv qhov zoo dua ntawm EMI cov ntaub ntawv thiab cov khoom tso tawm, tso cai rau SiP pob khoom tsim los siv cov txheej txheem ntim khoom zoo.
Nyob rau hauv xyoo tas los no, EMI shielding tau dhau los ua kev txhawj xeeb loj. Nrog rau kev hloov pauv loj ntawm 5G wireless thev naus laus zis thev naus laus zis thiab lub sijhawm yav tom ntej uas 5G yuav coj mus rau Is Taws Nem ntawm Yam (IoT) thiab kev sib txuas lus tseem ceeb, qhov xav tau los tiv thaiv cov khoom siv hluav taws xob zoo thiab kev sib dhos los ntawm kev cuam tshuam hluav taws xob tau nce. qhov tseem ceeb. Nrog rau 5G wireless tus qauv yuav los tom ntej, teeb liab zaus hauv 600 MHz txog 6 GHz thiab millimeter yoj bands yuav dhau los ua ntau dua thiab muaj zog raws li kev siv tshuab. Qee qhov kev thov siv thiab kev siv suav nrog lub qhov rais panes rau cov tsev ua haujlwm lossis kev thauj mus los rau pej xeem los pab kom muaj kev sib txuas lus luv luv.
Vim tias 5G zaus muaj teeb meem nkag mus rau phab ntsa thiab lwm yam khoom nyuaj, lwm qhov kev thov siv suav nrog cov neeg rov ua dua hauv tsev thiab cov tsev ua haujlwm kom muaj kev pab txaus. Tag nrho cov kev ua no yuav ua rau muaj kev nce ntxiv ntawm cov teeb liab hauv 5G zaus bands thiab muaj kev pheej hmoo siab dua ntawm kev cuam tshuam ntawm electromagnetic cuam tshuam hauv cov zaus bands thiab lawv cov harmonics.
Hmoov zoo, EMI tuaj yeem tiv thaiv los ntawm kev siv cov hlau nyias nyias rau cov khoom siv sab nraud thiab System-in-Package (SiP) cov khoom siv (Daim duab 1). Yav dhau los, EMI shielding tau siv los ntawm kev tso cov kaus poom hlau nyob ib ncig ntawm pawg ntawm cov khoom, lossis los ntawm kev siv cov ntaub thaiv npog rau qee yam khoom. Txawm li cas los xij, raws li cov pob khoom thiab cov khoom siv kawg txuas ntxiv mus rau qhov me me, qhov kev tiv thaiv kev tiv thaiv no yuav ua tsis tau vim qhov kev txwv loj thiab qhov yooj yim los tswj cov ntau yam ntawm cov ntsiab lus uas tsis yog orthogonal pob uas tau pom ntau ntxiv hauv cov khoom siv hluav taws xob thiab khoom siv hluav taws xob.
Ib yam li ntawd, qee cov qauv tsim pob tau txav mus rau kev xaiv tsuas yog qee qhov chaw ntawm pob rau EMI shielding, tsis yog npog tag nrho sab nrauv ntawm pob nrog tag nrho pob. Ntxiv nrog rau kev tiv thaiv sab nraud EMI, SiP cov cuab yeej tshiab yuav tsum muaj kev tiv thaiv kev tiv thaiv ntxiv rau hauv lub pob kom raug cais tawm ntau yam ntawm ib leeg hauv tib lub pob.
Txoj hauv kev tseem ceeb rau kev tsim EMI tiv thaiv ntawm cov khoom siv molded los yog molded SiP cov cuab yeej yog tshuaj tsuag ntau txheej hlau rau saum npoo. Los ntawm sputtering, nyias nyias txheej txheej ntawm cov hlau ntshiab lossis hlau alloys tuaj yeem tso rau ntawm pob qhov chaw nrog lub thickness ntawm 1 txog 7 µm. Vim hais tias cov txheej txheem sputtering muaj peev xwm muab cov hlau tso rau ntawm qib angstrom, cov khoom hluav taws xob ntawm nws cov txheej txheem kom deb li deb tau ua haujlwm zoo rau daim ntawv thov kev tiv thaiv.
Txawm li cas los xij, raws li qhov xav tau kev tiv thaiv loj hlob tuaj, sputtering muaj qhov cuam tshuam loj heev uas tiv thaiv nws los ntawm kev siv los ua ib txoj hauv kev loj hlob rau cov tuam txhab thiab cov tsim tawm. Tus nqi pib ntawm cov khoom siv tshuaj tsuag yog siab heev, nyob rau hauv ntau lab nyiaj daus las. Vim yog cov txheej txheem ntau lub chamber, cov khoom siv tshuaj tsuag yuav tsum muaj thaj tsam loj thiab ntxiv qhov kev xav tau ntxiv rau vaj tse ntxiv nrog rau kev hloov pauv tag nrho. Hom sputter chamber tej yam kev mob tuaj yeem ncav cuag 400 ° C ntau yam raws li cov plasma excitation sputters cov khoom los ntawm lub hom phiaj sputter mus rau substrate; Yog li ntawd, yuav tsum tau "txias phaj" mounting fixture kom txias lub substrate kom txo tau qhov kub thiab txias. Thaum lub sij hawm deposition txheej txheem, cov hlau yog muab tso rau ntawm ib tug muab substrate, tab sis, raws li txoj cai, txheej thickness ntawm ntsug sab phab ntsa ntawm ib tug 3D pob yog feem ntau mus txog 60% piv rau lub thickness ntawm lub sab sauv txheej.
Thaum kawg, vim qhov tseeb tias sputtering yog txoj kab ntawm qhov pom kev tso tawm, cov khoom hlau tsis tuaj yeem xaiv los yog yuav tsum tau muab tso rau hauv cov txheej txheem overhanging thiab topologies, uas tuaj yeem ua rau cov khoom tseem ceeb poob ntxiv rau nws cov tsub zuj zuj hauv cov phab ntsa chamber; yog li, nws yuav tsum tau kho ntau heev. Yog tias qee qhov chaw ntawm lub substrate yuav tsum tau tawm sab laug lossis EMI shielding tsis tas yuav tsum tau, lub substrate kuj yuav tsum tau npog ua ntej.
Daim ntawv dawb: Thaum tsiv los ntawm me me mus rau qhov loj assortment ntau lawm, optimizing lub throughput ntawm ntau batch ntawm cov khoom sib txawv yog ib qho tseem ceeb rau maximizing ntau lawm productivity. Kev siv kab tag nrho… Saib daim ntawv dawb
Post lub sij hawm: Apr-19-2023