Raws li peb txhua tus paub, txoj kev loj hlob ntawm lub hom phiaj cov khoom siv thev naus laus zis yog ze ze rau txoj kev loj hlob ntawm kev siv tshuab thev naus laus zis hauv kev lag luam downstream. Nrog rau kev txhim kho thev naus laus zis ntawm cov khoom siv yeeb yaj kiab lossis cov khoom siv hauv kev lag luam daim ntawv thov, lub hom phiaj thev naus laus zis yuav tsum hloov pauv. Piv txwv li, cov tuam txhab Ic tsis ntev los no tau tsom mus rau kev txhim kho cov kab hluav taws xob tsis tshua muaj hluav taws xob, uas yuav tsum tau hloov pauv cov thawj aluminium zaj duab xis nyob rau ob peb xyoos tom ntej no, yog li kev txhim kho cov phiaj xwm tooj liab thiab lawv cov phiaj xwm thaiv yuav tsum tau ceev.
Tsis tas li ntawd, nyob rau hauv xyoo tas los no, lub vaj huam sib luag tiaj tus (FPD) tau hloov pauv ntau ntawm cov kab hluav taws xob cathode (CRT) -raws li lub computer zaub thiab TV lag luam. Nws kuj tseem yuav ua rau kom muaj kev txawj ntse thiab kev lag luam xav tau rau ITO lub hom phiaj. Thiab tom qab ntawd muaj cov cuab yeej khaws cia. Qhov kev thov rau high-density, loj-muaj peev xwm hard drives thiab high-density erasable discs tseem nce. Tag nrho cov no tau ua rau muaj kev hloov pauv ntawm qhov kev thov rau cov ntaub ntawv hom phiaj hauv kev lag luam daim ntawv thov. Hauv cov hauv qab no, peb yuav qhia txog cov kev thov tseem ceeb ntawm lub hom phiaj thiab txoj kev loj hlob ntawm lub hom phiaj hauv cov teb no.
1. Microelectronics
Hauv txhua daim ntawv thov kev lag luam, kev lag luam semiconductor muaj cov kev cai nruj tshaj plaws rau lub hom phiaj sputtering films. Silicon wafers ntawm 12 nti (300 epistaxis) tau tsim tam sim no. Qhov dav ntawm qhov kev sib tshuam yog txo qis. Cov kev cai ntawm silicon wafer manufacturers rau lub hom phiaj cov ntaub ntawv yog loj teev, siab purity, tsis tshua muaj segregation thiab nplua nplej, uas yuav tsum tau lub hom phiaj cov ntaub ntawv kom muaj zoo microstructure. Lub crystalline particle txoj kab uas hla thiab uniformity ntawm lub hom phiaj cov ntaub ntawv tau raug suav hais tias yog cov tseem ceeb yam tseem ceeb cuam tshuam rau cov zaj duab xis deposition tus nqi.
Piv nrog rau txhuas, tooj liab muaj ntau dua electromobility kuj thiab qis resistivity, uas muaj peev xwm ua tau raws li qhov yuav tsum tau ntawm conductor technology nyob rau hauv submicron thaiv hauv qab no 0.25um, tab sis nws coj lwm yam teeb meem: tsawg adhesion zog ntawm tooj liab thiab organic nruab nrab cov ntaub ntawv. Ntxiv mus, nws yog ib qho yooj yim rau reacts, uas ua rau corrosion ntawm tooj liab interconnect thiab Circuit Court breakage thaum lub sij hawm siv cov nti. Yuav kom daws tau qhov teeb meem no, ib txheej thaiv yuav tsum tau teeb tsa ntawm cov tooj liab thiab dielectric txheej.
Lub hom phiaj cov ntaub ntawv siv nyob rau hauv lub barrier txheej ntawm tooj liab interconnection muaj xws li Ta, W, TaSi, WSi, thiab lwm yam. Tab sis Ta thiab W yog refractory hlau. Nws yog ib qho nyuaj rau kev ua, thiab cov alloys xws li molybdenum thiab chromium raug kawm ua lwm yam ntaub ntawv.
2. Rau cov zaub
Cov vaj huam sib luag tiaj tus (FPD) tau cuam tshuam zoo heev rau cathode-ray raj (CRT) -raws li lub khoos phis tawj saib thiab TV ua lag luam xyoo dhau los, thiab tseem yuav tsav cov thev naus laus zis thiab kev lag luam xav tau rau ITO cov khoom siv. Muaj ob hom ITO lub hom phiaj niaj hnub no. Ib qho yog siv nanometer lub xeev ntawm indium oxide thiab tin oxide hmoov tom qab sintering, lwm qhov yog siv indium tin alloy lub hom phiaj. ITO zaj duab xis tuaj yeem tsim los ntawm DC reactive sputtering ntawm indium-tin alloy lub hom phiaj, tab sis lub hom phiaj saum npoo yuav oxidize thiab cuam tshuam rau sputtering tus nqi, thiab nws yog ib qho nyuaj kom tau txais lub hom phiaj loj loj.
Niaj hnub no, thawj txoj kev feem ntau yog siv los tsim ITO cov khoom siv, uas yog sputtering txheej los ntawm magnetron sputtering cov tshuaj tiv thaiv. Nws muaj ib tug ceev deposition tus nqi. Cov yeeb yaj kiab tuab tuaj yeem raug tswj xyuas kom raug, cov khoom siv hluav taws xob yog siab, qhov sib xws ntawm zaj duab xis yog qhov zoo, thiab adhesion ntawm substrate muaj zog. Tab sis cov khoom siv lub hom phiaj yog qhov nyuaj ua, vim tias indium oxide thiab tin oxide tsis yooj yim sintered ua ke. Feem ntau, ZrO2, Bi2O3 thiab CeO raug xaiv raws li sintering additives, thiab lub hom phiaj cov ntaub ntawv nrog ib tug ceev ntawm 93% ~ 98% ntawm theoretical tus nqi yuav tau. Kev ua tau zoo ntawm ITO zaj duab xis tsim nyob rau hauv txoj kev no muaj kev sib raug zoo nrog cov additives.
Qhov thaiv kev tiv thaiv ntawm ITO zaj duab xis tau los ntawm kev siv cov khoom siv lub hom phiaj nce mus txog 8.1 × 10n-cm, uas yog ze rau qhov kev tiv thaiv ntawm cov yeeb yaj kiab ntshiab ITO. Qhov loj ntawm FPD thiab cov iav conductive yog qhov loj heev, thiab qhov dav ntawm cov iav conductive tuaj yeem ncav cuag 3133mm. Txhawm rau txhim kho kev siv cov khoom siv, ITO lub hom phiaj cov ntaub ntawv nrog cov duab sib txawv, xws li cov duab cylindrical, yog tsim. Xyoo 2000, National Development Planning Commission thiab Ministry of Science thiab Technology tau suav nrog ITO lub hom phiaj loj hauv Cov Lus Qhia rau Cov Chaw Tseem Ceeb ntawm Kev Lag Luam Kev Lag Luam Tam sim no ua ntej rau kev txhim kho.
3. Kev siv cia
Hais txog kev siv thev naus laus zis, kev txhim kho ntawm cov khoom siv siab thiab lub peev xwm loj loj yuav tsum muaj ntau ntawm cov ntaub ntawv tsis txaus ntseeg loj heev. CoF ~ Cu multilayer composite zaj duab xis yog cov qauv siv dav ntawm cov yeeb yaj kiab loj heev. TbFeCo alloy lub hom phiaj cov khoom xav tau rau kev sib nqus disc tseem nyob rau hauv kev txhim kho ntxiv. Cov hlau nplaum disc tsim nrog TbFeCo muaj cov yam ntxwv ntawm lub peev xwm loj, kev pab lub neej ntev thiab rov ua dua tsis sib cuag.
Antimony germanium telluride raws theem hloov kev nco (PCM) tau pom muaj peev xwm ua lag luam tseem ceeb, dhau los ua ib feem NOR flash nco thiab DRAM ua lag luam lwm txoj kev siv thev naus laus zis, txawm li cas los xij, hauv kev nqis tes ua nrawm dua ib qho ntawm cov teeb meem ntawm txoj hauv kev kom muaj yog tsis muaj rov pib dua. tam sim no ntau lawm tuaj yeem txo qis ntxiv tag nrho ntim tsev. Txo rov pib dua tam sim no txo qis kev siv lub cim xeeb, txuas ntxiv roj teeb lub neej, thiab txhim kho cov ntaub ntawv bandwidth, txhua yam tseem ceeb hauv cov ntaub ntawv niaj hnub no, cov neeg siv khoom siv tau yooj yim heev.
Post lub sij hawm: Aug-09-2022