TiAl Sputtering Target High Purity Thin Film Pvd Coating Custom Made
Aluminum Titanium
wikiō
ʻO ka wehewehe ʻana o ka Titanium Aluminum Sputtering Target
ʻOi aku ka kiʻekiʻe o ke koi o ka maikaʻi i manaʻo ʻia no ka uhi ʻana i ka sputter ma mua o ka ʻoihana maʻamau. Hoʻopili pololei ka microstructure like ʻole o ka pahuhopu i ka hana sputtering. Loaʻa iā mākou kahi ʻōnaehana hoʻokele maikaʻi a koho mākou i nā mea maka maʻemaʻe kiʻekiʻe a hoʻohui pono iā lākou e hōʻoia i ka homogeneity. Hoʻopuka ʻia ka pahu pahu pahu pahu Titanium Aluminum alloy ma o ke ʻano o ka kaomi wela wela.
Hiki i kā mākou Titanium Aluminum sputtering targets ke hāʻawi i kahi uhi nitride kūpaʻa kūʻokoʻa, Titanium aluminum nitride (TiAlN). ʻO TiAlN ka mea nui i kēia manawa ma ke ʻano he kiʻiʻoniʻoni no ka ʻoki ʻana i nā mea hana, nā ʻāpana sliding a me nā ʻāpana tribo. Loaʻa iā ia ka paʻakikī kiʻekiʻe, ka paʻakikī, ka hana kūʻokoʻa a me ka mahana oxidation.
ʻO kā mākou mau pahuhopu TiAl maʻamau a me kā lākou mau waiwai
Ti-75Al ma% | Ti-70Al ma% | Ti-67Al ma% | Ti-60Al ma% | Ti-50Al ma% | Ti-30Al ma% | Ti-20Al ma% | Ti-14Al ma% | |
Maʻemaʻe (%) | 99.7 | 99.7 | 99.7 | 99.7 | 99.8/99.9 | 99.9 | 99.9 | 99.9 |
ʻO ka mānoanoa(g/cm3) | 3.1 | 3.2 | 3.3 | 3.4 | 3.63/3.85 | 3.97 | 4.25 | 4.3 |
Gua Nui(µm) | 100 | 100 | 100 | 100 | 100/- | - | - | - |
Kaʻina hana | HIP | HIP | HIP | HIP | HIP/VAR | VAR | VAR | VAR |
Titanium Aluminum Sputtering Target Packaging
Hoʻopili ʻia kā mākou Titanium Aluminum sputter target ma waho e hōʻoia i ka ʻike kūpono a me ka mana maikaʻi. Mālama nui ʻia e pale aku i nā pōʻino i hiki ke hana ʻia i ka wā mālama a lawe ʻia paha.
Loaʻa i ka Hoʻokaʻaʻike
ʻO nā pahu hoʻoheheʻe Titanium Aluminum o RSM he maʻemaʻe kiʻekiʻe loa a me ka lole. Loaʻa iā lākou ma nā ʻano like ʻole, ka maʻemaʻe, ka nui, a me nā kumukūʻai.
Hiki iā mākou ke hāʻawi i nā ʻano geometric like ʻole: nā paipu, nā cathodes arc, planar a i hana maʻamau, a me ka laulā ākea o ka Aluminum. ʻO kā mākou huahana e hōʻike ana i nā waiwai mechanical maikaʻi loa, microstructure homogeneous, ʻili poli me ka ʻole o ka hoʻokaʻawale ʻana, nā pores, a me nā māwae.
Hoʻomaʻamaʻa mākou i ka hana ʻana i nā mea hoʻoheheʻe kiʻi ʻoniʻoni maʻemaʻe kiʻekiʻe me ka hana maikaʻi loa e like me ke kiʻekiʻe kiʻekiʻe loa a me ka liʻiliʻi liʻiliʻi awelika nui o ka palaoa no ka hoʻohana ʻana i ka uhi ʻana i ka mold, hoʻonani, nā ʻāpana kaʻa, haʻahaʻa-E aniani, semi-conductor integrated circuit, thin film. kū'ē, hōʻike kiʻi, aerospace, hoʻopaʻa leo magnetic, pā paʻi, kiʻi ʻoniʻoni ʻoniʻoni ʻoniʻoni solar a me nā hoʻoheheʻe kino kino ʻē aʻe. (PVD) noi. E ʻoluʻolu e hoʻouna mai iā mākou i kahi nīnau no nā kumukūʻai o kēia manawa ma nā sputtering targets a me nā mea hoʻopaʻa ʻē aʻe ʻaʻole i helu ʻia.