Nā hiʻohiʻona o nā pahu hoʻoheheʻe alumini maʻemaʻe kiʻekiʻe

I nā makahiki i hala iho nei, me ka holomua o ka ʻenehana integrated circuit (IC), ua hoʻomohala wikiwiki ʻia nā noi pili o nā kaʻa hoʻohui. ʻO ka pahuhopu hoʻomaʻemaʻe kiʻekiʻe kiʻekiʻe alumini alumini sputtering, ma ke ʻano he mea kākoʻo i ka hana ʻana i nā mea pili metala kaapuni hoʻohui, ua lilo i kumuhana wela i ka noiʻi kūloko hou. e hōʻike mai ka mea hoʻoponopono o RSM iā mākou i nā hiʻohiʻona o ke kiʻekiʻe maʻemaʻe alumini alumini sputtering target.

I mea e hoʻomaikaʻi hou ai i ka pono sputtering o ka magnetron sputtering target a hōʻoia i ka maikaʻi o nā kiʻiʻoniʻoni i waiho ʻia, hōʻike ka nui o nā hoʻokolohua aia kekahi mau koi no ka haku mele ʻana, microstructure a me ka orientation o ka ultra-high purity alumini alumini sputtering target.

ʻO ka nui o ka palaoa a me ka hoʻonohonoho ʻana i ka palaoa o ka pahu hopu ka mana nui i ka hoʻomākaukau a me nā waiwai o nā kiʻiʻoniʻoni IC. Hōʻike nā hopena i ka emi ʻana o ka helu deposition me ka piʻi ʻana o ka nui o ka palaoa; No ka pahu pahu me ka haku like, ʻoi aku ka wikiwiki o ka sputtering o ka pahu me ka liʻiliʻi liʻiliʻi ma mua o ka pahu me ka nui o ka palaoa; ʻOi aku ka like o ka nui o ka palaoa o ka pahuhopu, ʻoi aku ka like o ka māhele mānoanoa o nā kiʻiʻoniʻoni i waiho ʻia.

Ma lalo o ka mea kani sputtering like a me ke kaʻina hana, hoʻonui ka sputtering rate o Al Cu alloy target me ka piʻi ʻana o ka atomic density, akā paʻa maʻamau i kahi ākea. ʻO ka hopena o ka nui o ka palaoa ma ka sputtering rate ma muli o ka hoʻololi ʻana o ka nui atomic me ka loli o ka nui o ka palaoa; Hoʻopili nui ʻia ka helu deposition e ka orientation palaoa o Al Cu alloy target. Ma ke kumu o ka hōʻoia ʻana i ka māhele o (200) mau mokulele aniani, ʻo ka hoʻonui ʻia o ka māhele o (111), (220) a me (311) mau mokulele aniani e hoʻonui i ka helu deposition.

ʻO ka nui o ka palaoa a me ka hoʻonohonoho ʻana o ka ultra-high purity alumini alumini i hoʻoponopono ʻia a mālama ʻia e ka homogenization ingot, ka hana wela a me ka recrystallization annealing. Me ka hoʻomohala ʻana o ka nui wafer i 20.32cm (8in) a me 30.48cm (12in), ke piʻi nei ka nui o ka pahuhopu, e kau ana i mua i nā koi kiʻekiʻe no ka ultra-high pure alumini alumini sputtering targets. I mea e hōʻoiaʻiʻo ai i ka maikaʻi o ke kiʻiʻoniʻoni a me ka hoʻohua ʻana, pono e hoʻomalu pono ʻia nā ʻāpana kaʻina hana i mea e hana ai i ka ʻaʻahu microstructure target a ʻo ka orientation o ka palaoa e loaʻa i nā ʻano leʻaleʻa mokulele (200) a me (220).