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CuW Sputtering Target High Purity Thin Film Pvd Coating Custom Made

Copper Tungsten

ʻO ka wehewehe pōkole:

Māhele

Alloy Sputtering Target

ʻO ke kimekema

CuW

Huina

Copper Tungsten

Maemae

99.9%,99.95%,99.99%

Kinohi

ʻO nā pā, nā pahu pahu, nā cathodes arc, hana maʻamau

Kaʻina Hana Hana

PM

Nui Loaʻa

L≤200mm,W≤200mm


Huahana Huahana

Huahana Huahana

Hoʻokumu ʻia ka Copper Tungsten alloy sputtering target e ka pauka metallurgy. ʻO ka nui o ke keleawe ma waena o 10% a me 50%. He maikaʻi ka wela a me ka uila conductivity, kiʻekiʻe wela ikaika a me ka ductility. Ma nā wela kiʻekiʻe loa, e like me ma luna o 3000 ° C, ua hoʻoheheʻe ʻia ke keleawe i loko o ka mea hoʻoheheʻe ʻia a hoʻoheheʻe ʻia, e hoʻomoʻi i ka nui o ka wela, a hoʻemi i ka mahana o ka ʻili o ka mea. ʻO kēia ʻano mea i kapa ʻia he mea hoʻoheheʻe metala.

No ka mea ʻaʻole kūpono nā metala ʻelua o Tungsten a me Copper kekahi i kekahi, ʻo Copper-Tungsten alloy ka haʻahaʻa haʻahaʻa, ke kūpaʻa ʻana, ka pale ʻana o ka tungsten a me ke kiʻekiʻe o ka uila a me ka thermal conductivity o ke keleawe, a ua kūpono ia no nā ʻano hana mechanical. Hiki ke hana ʻia nā ʻāpana Copper Tungsten e like me nā koi o ka mea hoʻohana no ka hana ʻana o Copper-Tungsten ratio a me ka hoʻoili ʻana i ka nui. Hoʻohana maʻamau ʻo Copper-Tungsten alloys i nā kaʻina hana metallurgy pauka e hoʻomākaukau ai i ka pauka-batch mixing-press molding-sintering infiltration.

ʻO Rich Special Materials kūikawā i ka hana ʻana i ka Sputtering Target a hiki ke hana i nā mea Copper-Tungsten Sputtering Materials e like me nā kikoʻī o nā mea kūʻai aku. No ka 'ike hou aku, e 'olu'olu e leka uila mai.


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